Circuit board glue filling method, equipment, system and computer storage medium
A circuit board and glue filling technology, which is applied in printed circuit, multi-layer circuit manufacturing, printed circuit manufacturing, etc., can solve problems such as local lack of glue, affecting product quality, voids or white spots, etc.
Active Publication Date: 2019-08-27
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
However, due to the uniformity of pattern distribution, the amount of glue required for areas with sparse line distribution is much greater than that required for areas with densely distributed lines
Especially for circuit boards with a large area of copper-free area, if the above-mentioned requirements for the residual copper ratio of the entire board are met, there may also be local glue shortage problems, resulting in defects such as lamination delamination, voids or white spots, which affect product quality.
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[0047] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0048] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or a central element may also exist. When an element is considered to be "connected" to another element, it can be directly connected to the other element or an intermediate element may be present at the same time. In contrast, when an element is referred to as being "directly on" another element, there are no intervening ele...
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The invention relates to a circuit board glue filling method, equipment, system and computer storage medium. The circuit board glue filling method includes the following steps: providing a PCB board and a prepreg with a total glue amount of P; obtaining the area S of the copper-free area on the PCB board 1 And the required residual copper rate of the whole board C 1 ;According to the total glue volume P of the prepreg, the glue flow area S corresponding to the total glue volume P of the prepreg is obtained 2 ; Calculate the local residual copper rate C corresponding to the copper-free area 2 = 1‑S 1 / (S 1 +S 2 ); compare the residual copper rate of the whole board C 1 and local residual copper ratio C 2 size, if C 1 ≥C 2 , then use the prepreg for filling. The circuit board glue filling equipment includes: an acquisition unit, a calculation unit, a calculation unit and a comparison unit. The circuit board glue filling method, equipment, system and computer storage medium provided by the present invention can avoid the problem of local lack of glue on the circuit board and ensure product quality.
Description
Technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a method, equipment, system and computer storage medium for filling a circuit board with glue. Background technique [0002] Laminating is a key part of the circuit board production process, and the quality of the circuit board pressing has a direct impact on the production of subsequent processes and the reliability of the product. When using a prepreg to fill the glue, generally ensure that the difference between the total glue amount of the prepreg and the amount of glue required for the line gap is greater than or equal to a certain set value. However, due to the problem of the uniformity of the pattern distribution, the amount of glue required for the sparsely distributed area is much greater than that for the densely distributed area. Especially for a circuit board with a large copper-free area, the problem of partial lack of glue may also occur when the above-...
Claims
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IPC IPC(8): H05K3/46H05K3/36
CPCH05K3/368H05K3/4632H05K2203/0126H05K2203/068
Inventor 吴森李娟李艳国
Owner GUANGZHOU FASTPRINT CIRCUIT TECH