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Measuring method, apparatus and system for object deformation under high temperature environment

A measurement method and technology in high temperature environment, applied in measurement devices, optical devices, instruments, etc., can solve the problem of low measurement image accuracy, and achieve the effect of eliminating excessive brightness differences

Inactive Publication Date: 2017-09-15
苏州卡睿知光电科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect of low measurement image accuracy caused by the temperature difference of high-temperature objects in the prior art, so as to provide a method, device and system for measuring deformation of objects in high-temperature environments

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  • Measuring method, apparatus and system for object deformation under high temperature environment
  • Measuring method, apparatus and system for object deformation under high temperature environment
  • Measuring method, apparatus and system for object deformation under high temperature environment

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Embodiment 1

[0049] This embodiment provides a method for measuring object deformation in a high-temperature environment, which is applied to a measurement system for object deformation in a high-temperature environment. When the measurement starts, use the measurement system to collect an image under the initial attenuation rate, and then adjust the attenuation rate. The attenuation rate is increased to a fixed value, and then the image under this attenuation rate is collected by the measurement system. Repeat the above adjustment of attenuation rate and acquisition until all the set attenuation rates have been traversed and returned to the initial attenuation rate. The measurement method of object deformation under the high temperature environment described in this embodiment, such as figure 1 shown, including the following steps:

[0050] S1: Acquire a first image, where the first image is an image corresponding to the first attenuation rate;

[0051]S2: Acquire a second image, where ...

Embodiment 2

[0063] This embodiment provides a measuring device for object deformation in a high-temperature environment, such as figure 2 shown, including:

[0064] The first acquisition unit 21 is configured to acquire a first image, where the first image is an image corresponding to the first attenuation rate;

[0065] The second acquisition unit 22 is configured to acquire a second image, where the second image is an image corresponding to the second attenuation rate;

[0066] The calculation unit 23 is configured to calculate deformation information of the object according to the gray values ​​of the first image and the second image.

[0067] The above-mentioned measuring device for measuring the deformation of an object in a high-temperature environment, through a deformation measurement of a high-temperature object based on attenuation rate and image processing technology, eliminates the influence of excessive brightness differences on the surface of an object in a high-temperatur...

Embodiment 3

[0073] This embodiment provides a measurement system for object deformation in a high temperature environment, such as image 3 shown, including:

[0074] An image acquisition device 31, which can automatically adjust the attenuation rate according to a preset program;

[0075] The measuring device 32 described in Embodiment 2 of the present invention;

[0076] The image acquisition device 31 is electrically connected to the measurement device 32 , and the image collected by the image acquisition device 31 is measured by the measurement device 32 .

[0077] As an optional implementation of this embodiment, the image acquisition device 31 includes: a lens, a filter or a filter set, and a camera; the filter or the filter set is arranged on the lens Between and the camera; the filter set can automatically adjust the attenuation rate according to a preset program.

[0078] As an optional implementation of this embodiment, the filter or filter set is a filter set with a rotating...

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Abstract

The invention relates to the technical field of high temperature object measurement, and provides a measuring method, apparatus and system for object deformation under high temperature environment. The measuring method includes the following steps: acquiring a first image which corresponds to a first attenuation rate; acquiring a second image which corresponds to a second attenuation rate; based on the gray values of the first image and the second image, computing the deformation information of an object. According to the invention, the deformation measuring method for high temperature objects is based on attenuate rate and image processing technologies, eliminates excessive brightness difference on the surface of the object under high temperature environment, and realizes deformation measurement of objects having greater temperature difference under high temperature environment.

Description

technical field [0001] The invention relates to the field of high-temperature object measurement, in particular to a method, device and system for measuring object deformation in a high-temperature environment. Background technique [0002] The impact of high temperature on materials or structures is mainly reflected in two aspects: 1) Temperature will affect the physical and mechanical properties of materials. For example, the high-temperature mechanical properties of materials are different from room temperature, and the high temperature generated by the start-up heat will reduce the strength limit and load-bearing capacity of high-speed aircraft materials, so the mechanical parameters (such as elastic modulus, strength limit and thermal expansion) of these materials in high-temperature environments are determined. coefficient, etc.), which are of great significance to the safety design, reliability assessment and life prediction of materials and structures; 2) The tempera...

Claims

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Application Information

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IPC IPC(8): G01B11/16
CPCG01B11/16
Inventor 夏明亮李抄杨磊
Owner 苏州卡睿知光电科技有限公司
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