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Damping structure of loudspeaker

A loudspeaker and support frame technology, applied in the field of loudspeakers, can solve the problems of high-pitched loudspeakers being easily interfered, affecting sound effects, etc., so as to achieve good sound effects and avoid output distortion.

Inactive Publication Date: 2018-03-06
TIANJIN BODUN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the woofer with a large vibration will transmit the vibration to the tweeter with a small vibration amplitude through the speaker box, so that the treble of the tweeter is easily disturbed and affects the sound effect

Method used

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  • Damping structure of loudspeaker
  • Damping structure of loudspeaker
  • Damping structure of loudspeaker

Examples

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Embodiment Construction

[0016] Below, the substantive features and advantages of the present invention will be further described in conjunction with examples, but the present invention is not limited to the listed examples.

[0017] as the present invention Figure 1 to Figure 4 As shown, the shock absorbing structure of the loudspeaker in this embodiment can be used in the sound box 100, and the sound box 100 includes the loudspeaker 2 for emitting high-pitched sound. A subwoofer 8 is arranged below the speaker 2 for emitting bass. The shock absorbing structure includes a support frame and a bottom plate 1 , the loudspeaker 2 is arranged on the bottom plate 1 through the support frame, and the bottom plate 1 is connected with the sound box 100 . The support frame includes a first support frame 3 and a second support frame 4 . The shock-absorbing structure further includes an elastic member 5 , a positioning plate 6 and an outer frame 7 , the positioning plate 6 is arranged opposite to the bottom p...

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Abstract

The invention relates to a shock absorbing structure of a loudspeaker, comprising a support frame and a bottom plate, the speaker is arranged on the bottom plate through the support frame, the support frame includes a first support frame and a second support frame, and the shock absorption structure also includes an elastic member , a positioning plate and an outer frame, the positioning plate is arranged opposite to the bottom plate, the speaker is arranged between the positioning plate and the outer frame, the bottom plate and the outer frame are connected by a first support frame, and the speaker is fixed on the second support frame On the positioning plate, the first support frame and the second support frame are arranged oppositely and at intervals, and the elastic members are respectively connected to the first support frame and the second support frame. The shock absorbing structure of the loudspeaker of the present invention can reduce the impact of the loudspeaker by surrounding vibrations, thereby avoiding output distortion; in addition, the front and rear positions of the loudspeaker can be adjusted to obtain better sound effects.

Description

technical field [0001] The invention relates to the technical field of loudspeakers, in particular to a shock-absorbing structure of the loudspeaker. Background technique [0002] At present, a speaker is a commonly used sound output device. The speaker usually includes a plurality of speakers, such as a tweeter and a woofer. The tweeter and the woofer resonate inside the speaker, thereby improving the sound effect. Since the diaphragm of the woofer produces large and slow vibrations when producing bass, the diaphragm of the tweeter produces small and fast vibrations. Therefore, the woofer with a large vibration will transmit the vibration to the tweeter with a small vibration amplitude through the sound box, so that the treble of the tweeter is easily disturbed and affects the sound effect. Contents of the invention [0003] The object of the present invention is to solve the above-mentioned technical problems and provide a shock-absorbing structure of a loudspeaker. ...

Claims

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Application Information

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IPC IPC(8): H04R9/06H04R9/02
CPCH04R9/06H04R9/02H04R2400/11
Inventor 吴宝忠
Owner TIANJIN BODUN ELECTRONICS
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