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Wafer inspection method and wafer inspection device

A technology for inspection devices and wafers, which is applied to measurement devices, instruments, semiconductor/solid-state device testing/measurement, etc., can solve problems such as complicated inspection conditions, and achieve the effect of preventing unilateral collisions

Active Publication Date: 2022-05-17
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in recent years, the inspection conditions when inspecting wafers have become more complicated, and in particular, inspections in high-temperature environments and low-temperature environments are often performed.

Method used

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  • Wafer inspection method and wafer inspection device
  • Wafer inspection method and wafer inspection device
  • Wafer inspection method and wafer inspection device

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Embodiment Construction

[0028] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0029] First, a wafer inspection apparatus that executes the wafer inspection method of this embodiment will be described.

[0030] figure 1 is a horizontal cross-sectional view schematically showing the configuration of a wafer inspection apparatus for executing the wafer inspection method of this embodiment, figure 2 is along figure 1 Cross-sectional view of the line II-II.

[0031] exist figure 1 and figure 2 Among them, the wafer inspection apparatus 10 includes an inspection chamber 11, and the inspection chamber 11 includes: an inspection area 12 for inspecting the electrical characteristics of each semiconductor device of the wafer W; a loading / unloading area 13 for carrying the wafer W into and out of the inspection chamber 11; A transport area 14 is provided between the inspection area 12 and the carry-in area 13 .

[0032] Detectors 15 serving as in...

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Abstract

The present invention provides a wafer inspection method capable of properly receiving chuck upper end parts. After the inspection of the wafer W is carried out, when the aligner (32) is to accept the chuck upper part (29), the chuck upper part (29) and the chuck part (29) are adjusted by adjusting the inclination of the chuck base (49). The distance of the base (49) is such that the distance between the retained chuck upper part (29) and the chuck base (49), that is, the height of each chuck upper part becomes that the height of each chuck upper part before holding is uniformly plus 0 μm. The height obtained from any value in ~200μm.

Description

technical field [0001] The present invention relates to a wafer inspection method and a wafer inspection device using a probe card for wafer inspection. Background technique [0002] As a probe of an inspection apparatus for inspecting a wafer on which a plurality of semiconductor devices are formed, a probe card having a plurality of contact probes as columnar contact terminals is included, and by bringing the wafer into contact with the probe card, each contact probe The needles come into contact with electrode pads and solder bumps in the semiconductor device, and the electric circuit of the semiconductor device connected to each electrode pad and each solder bump is energized from each contact probe to check the conduction state of the circuit. [0003] In recent years, in order to improve the inspection efficiency of wafers, a wafer inspection device has been developed, which has a plurality of probe cards, and in the process of transferring a wafer to one probe card by...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G01R31/28H01L21/68
CPCG01R31/2865G01R31/2891G01R1/07307G01R31/287G01R31/2886G01R31/2887H01L21/68
Inventor 山田浩史
Owner TOKYO ELECTRON LTD