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Integrated Circuit Device Testing in Inert Gas

An inert gas, testing integrated circuit technology, applied in the field of integrated circuit device testing, can solve the problems of high equipment capacity, increased labor cost, increased lead material cost, etc.

Active Publication Date: 2022-05-27
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, retesting requires higher equipment capacity, increases pin material costs, and increases labor costs

Method used

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  • Integrated Circuit Device Testing in Inert Gas
  • Integrated Circuit Device Testing in Inert Gas
  • Integrated Circuit Device Testing in Inert Gas

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Embodiment Construction

[0009] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof and in which specific examples in which the present disclosure may be practiced are shown by way of illustration. It is to be understood that other examples may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. Therefore, the following detailed description is not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims.

[0010] It should be understood that the features of the various examples described herein may be combined with each other unless specifically stated otherwise.

[0011] The presence of oxide layers on the leads of integrated circuit (IC) devices can result in high contact resistance during testing. Tin (Sn) plating on leads may become oxidized to form tin oxide (SnO) prior to testing. IC devices can be tested in hot air, whi...

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Abstract

The invention discloses an integrated circuit device test carried out in an inert gas. A system includes an inert gas supply, a soak chamber, a test chamber, a transfer zone, and a heater. The soak chamber allows integrated circuit (IC) devices to be soaked in an inert gas prior to testing. The test chamber includes contact pins for testing the IC device in an inert atmosphere by contacting the test pins to leads of the IC device. The transfer area is used to transfer IC devices from the soak chamber to the test chamber. The heater heats the inert gas supplied to the soak chamber and test chamber.

Description

technical field [0001] The present invention relates to integrated circuit device testing in an inert gas. Background technique [0002] In the testing of integrated circuit (IC) devices, electrical contact between the tester and the IC device is critical to test yield. Good cells may fail during testing simply due to high contact resistance between the test pins of the tester and the leads of the IC device. When a unit fails initially, the unit is usually retested to avoid false failures. However, retesting requires higher device capacity, increases lead material costs, and increases labor costs. An increase in first-pass test yield equates to an increase in productivity or a reduction in the cost of testing. [0003] For these and other reasons, there exists a need for the present invention. SUMMARY OF THE INVENTION [0004] An example of a system includes an inert gas supply, a soaking chamber, a testing chamber, a transfer zone, and a heater. This soaking chamber ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G01R31/28
CPCG01R31/2851H01L22/10G01R31/2862G01R31/2875G01R31/2898
Inventor G.H.于莱M.拉菲张南德T.H.黄薛明
Owner INFINEON TECH AG