Three-dimensional chip integrated circuit cooling system
A technology of integrated circuits and three-dimensional chips, applied in circuits, electrical components, electric solid devices, etc., can solve problems such as inability to meet application requirements, poor heat dissipation efficiency, etc.
Inactive Publication Date: 2018-07-13
MICROJET TECH
View PDF6 Cites 5 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the above-mentioned heat dissipation method is a passive heat dissipation method, which only uses heat conduction and natural convection to achieve the heat dissipation effect, and its heat dissipation efficiency is poor, which cannot meet the application requirements.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0024] Some typical embodiments embodying the features and advantages of the present application will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are used for illustration in nature, rather than to limit this case.
[0025] see Figure 1A and Figure 1B , Figure 1A It is a structural schematic diagram of the three-dimensional chip integrated circuit cooling system of the first preferred embodiment of the present case, and Figure 1B for Figure 1A The schematic diagram of the cross-sectional structure of the three-dimensional chip integrated circuit cooling system shown. Such as Figure 1A and 1B As shown, the three-dimensional chip integrated circuit cooling system 1 of this case can be applied to an electronic device, such as but not limited to a portable computer,...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a three-dimensional chip integrated circuit cooling system and is used for carrying out heat dissipation on a three-dimensional chip integrated circuit. The three-dimensional chip integrated circuit is formed by stacking a master chip layer and a plurality of intermediate chip layers and has a plurality of fluid micro-channels. The three-dimensional chip integrated circuit cooling system comprises a carrier and a fluid pump. The carrier is correspondingly set at one side of the three-dimensional chip integrated circuit and has an import end opening, a discharge end opening and a fluid channel. The fluid pump is set on the carrier and seals the import end opening. The fluid pump is driven to import fluid from the import end opening, the fluid is discharged from the discharge end opening, the fluid discharged from the discharge end opening is enabled to flow into the fluid micro-channels of the three-dimensional chip integrated circuit, and the fluid carries out heat exchange with the intermediate chip layers or the master chip layer.
Description
【Technical field】 [0001] This case concerns a three-dimensional chip integrated circuit cooling system, especially a three-dimensional chip integrated circuit cooling system that uses a fluid pump to drive fluid flow for heat dissipation. 【Background technique】 [0002] With the advancement of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, audio-visual players, etc. have developed towards thinner, portable and high-performance trends. These electronic devices Various high-integration or high-power electronic components must be arranged in its limited internal space. In order to make the electronic equipment faster and more powerful, the electronic components inside the electronic equipment will generate more heat during operation. , and lead to high temperature. In addition, most of these electronic devices are designed to be thin, flat and compact, and there is no additional interna...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L23/46
CPCH01L23/46
Inventor 莫立邦陈世昌黄启峰韩永隆
Owner MICROJET TECH