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Resin sealing device, resin sealing method, and mold for resin sealing

A resin encapsulation device and resin encapsulation technology are applied in the manufacture of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., and can solve problems such as inability to attract substrates

Inactive Publication Date: 2018-07-31
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is because the substrate cannot be sucked because the suction hole is blocked by the film

Method used

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  • Resin sealing device, resin sealing method, and mold for resin sealing
  • Resin sealing device, resin sealing method, and mold for resin sealing
  • Resin sealing device, resin sealing method, and mold for resin sealing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] refer to Figure 1A ~ Figure 1B , the structure of the molding module included in the resin sealing device of the present invention will be described. Any drawing in this application document is appropriately omitted or exaggerated and drawn schematically for easy understanding. The same reference numerals are used for the same structural elements, and explanations thereof are appropriately omitted.

[0081] Figure 1A The shown resin sealing device 1A is a resin sealing device using a compression molding method. In resin sealing device 1A, molding block 2 has lower base 3 . Four connecting rods 4 as support members are fixed to the four corners of the lower base 3 . An upper base 5 facing the lower base 3 is fixed to upper portions of the four connecting rods 4 extending upward. Between the lower base 3 and the upper base 5 , the lifting plates 6 facing the lower base 3 and the upper base 5 are embedded on the four connecting rods 4 . A mold opening and closing me...

Embodiment 2

[0127] refer to Figure 4 , the resin sealing device 1B of the present invention will be described. Figure 4 The shown resin sealing device 1B is a resin sealing device using a compression molding method. The resin sealing apparatus 1B includes a substrate supply and storage module 24 , three molding modules 25A, 25B, and 25C, and a material supply module 26 as constituent elements. The substrate supply and storage module 24 , the molding modules 25A, 25B, and 25C, and the material supply module 26 , which are structural elements, are detachable from each other and can be replaced. Each molding module 25A, 25B, 25C corresponds to Figure 1A The resin-encapsulated device 1A is shown.

[0128] The substrate supply and storage module 24 is provided with: a pre-encapsulation substrate supply part 28, which supplies the pre-encapsulation substrate 27; a post-encapsulation substrate accommodating part 30, which accommodates the post-encapsulation substrate 29; a substrate 29 ; a...

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PUM

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Abstract

An electrostatic chuck provided to the surface of a top mold is used to sequentially or simultaneously draw together, by means of the attractive force of static electricity, a substrate on which a chip is mounted and a releasing film. This causes the substrate and the releasing film to be closely adhered to and retained on the surface of the top mold while being closely adhered to each other. By closing the top and bottom molds, the substrate and the chip mounted on the substrate are submerged in molten resin inside of the cavity. When seen in plan view, the substrate is contained in the cavity, and therefore the substrate and chip are completely submerged in the molten resin. Once resin sealing has been completed, the top and side surfaces of the substrate and chip will be covered by hardened resin.

Description

technical field [0001] The present invention relates to a resin encapsulating device, a resin molding method, and a molding die, and more particularly to a resin encapsulating device, a resin encapsulating method, and a resin encapsulating molding die used when resin-encapsulating chip-shaped electronic devices and the like. Background technique [0002] Conventionally, a chip-shaped electronic device (hereinafter, appropriately referred to as a "chip") mounted on a substrate corresponding to a functional component has been resin-encapsulated with a cured resin molded by the resin molding technique. The chips include semiconductor chips such as transistors, integrated circuits (Integrated Circuit: IC), and light emitting diodes (Light Emitting Diode: LED). Examples of the substrate include semiconductor wafers such as silicon substrates, printed circuit boards (PCB: Printed Circuit Board), lead frames, and ceramic substrates. [0003] A release film is used when resin-encap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56B29C43/18B29C43/34B29C43/36
CPCB29C43/18B29C43/34B29C43/36H01L2224/97H01L2924/181H01L21/56H01L2924/00012H01L21/565H01L21/67126H01L21/67132H01L21/6831
Inventor 田村孝司高田直毅喜多仁川本佳久
Owner TOWA