Cyanide-free silver plating electric plating liquid capable of being used for dynamically monitoring copper ion pollution content, simple convenient and fast detection method and quantitative detection method

A cyanide-free silver-plating and dynamic monitoring technology is applied in the field of quantitative detection and cyanide-free silver-plating electroplating solution. Copper ion content, color stabilization effect

Active Publication Date: 2018-09-11
JIAXING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with cyanide silver plating, there are still many shortcomings in cyanide-free silver plating. The main problems are: (1) the stability of the plating solution
The stability of many cyanide-free silver plating solutions is not good, whether it is an alkaline plating solution or an acidic plating solution, there are problems in the stability of the plating solution to varying degrees, which brings inconvenience to management and operation, and increases the cost
(2) The cost of plating solution is higher
Copper ion pollution will not change the composition of the coating, but it still has a certain impact on the process range, and its bright current density range is reduced

Method used

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  • Cyanide-free silver plating electric plating liquid capable of being used for dynamically monitoring copper ion pollution content, simple convenient and fast detection method and quantitative detection method
  • Cyanide-free silver plating electric plating liquid capable of being used for dynamically monitoring copper ion pollution content, simple convenient and fast detection method and quantitative detection method
  • Cyanide-free silver plating electric plating liquid capable of being used for dynamically monitoring copper ion pollution content, simple convenient and fast detection method and quantitative detection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] (1) Prepare a cyanide-free silver plating solution containing a copper ion indicator of 8 g / L ethylenediaminetetraacetic acid (EDTA);

[0034] (2) Experimentally weigh 4.88 g CuSO 4 • 5H 2 O, prepare 50.00 mL of 25.0 g / L solution with primary deionized water;

[0035] (3) Then use the cyanide-free silver plating solution to dilute and prepare Cu in the concentration of 0.001, 0.002, 0.004, 0.01, 0.02, 0.05, 0.1, 0.2, 0.3, 0.5, 1.0, 1.5, 2.0, 3.0 g / L 2+ solution;

[0036] (4) Randomly take out samples of the plating solution during the cyanide-free silver plating process, and compare with step (3).

[0037] The result is as figure 1 As shown, the solution configured in step (3) along with Cu 2+ As the concentration increases, the color gradually becomes darker, and the color difference in the range of 0.1-1g / L is obvious, and the color in the part less than 0.1 g / L and the part greater than 1 g / L is too light or too dark, and the color difference is not large. Judg...

Embodiment 2

[0039] (1) Prepare a cyanide-free silver plating solution containing 4 g / L of hydroxyethylidene diphosphonic acid (HEDP) and 7 g / L of potassium citrate as a copper ion indicator;

[0040] (2) Experimentally weigh 4.88 g CuSO 4 • 5H 2 O, prepare 50.00 mL of 25.0 g / L solution with primary deionized water;

[0041] (3) Then use the cyanide-free silver plating solution to dilute and prepare Cu in the concentration of 0.01, 0.02, 0.04, 0.1, 0.2, 0.5, 1.0, 2.0, 3.0 g / L in sequence 2+ solution;

[0042] (4) Randomly take out samples of the plating solution during the cyanide-free silver plating process, and compare with step (3).

[0043] The result is as figure 1 As shown, the solution configured in step (3) along with Cu 2+ As the concentration increases, the color gradually becomes darker, and the color of the plating solution sample in step (4) is between 0.1 g / L and 0.2 g / L. After accurate detection by ICP, the concentration of the plating solution sample in step (4) was 0.1...

Embodiment 3

[0045] (1) Configure a copper ion indicator containing 2 g / L of hydroxyethylidene diphosphonic acid (HEDP), 5 g / L of aminotrimethylene phosphonic acid (ATMP), and 1 g / L of ethylenediaminetetraacetic acid (EDTA) Cyanide-free silver plating solution;

[0046] (2) Experimentally weigh 4.88 g CuSO 4 • 5H 2 O, prepare 50.00 mL of 25.0 g / L solution with primary deionized water;

[0047] (3) Then use the cyanide-free silver plating solution to dilute and prepare Cu2+ solutions with concentrations of 0.01, 0.02, 0.04, 0.1, 0.2, 0.5, 1.0, and 2.0 g / L in sequence;

[0048] (4) Randomly take out samples of the plating solution during the cyanide-free silver plating process, and compare with step (3).

[0049] The result is as figure 1 As shown, the solution configured in step (3) along with Cu 2+ As the concentration increases, the color gradually becomes darker, but the overall color is relatively light, and the low concentration of Cu 2+ It is difficult to detect the concentratio...

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Abstract

The invention belongs to the field of cyanide-free silver plating, and particularly relates to cyanide-free silver plating electric plating liquid capable of being used for dynamically monitoring thecopper ion pollution content, a simple convenient and fast detection method and a quantitative detection method. A copper ion concentration indicator is mainly added into the cyanide-free silver plating electric plating liquid. The copper ion concentration indicator is added into the cyanide-free silver plating electric plating liquid; the goal of monitoring the change of copper ion content in real time can be realized in a color development mode under the condition of not influencing the basic performance of the plating liquid; the copper ion content can be simply, conveniently and fast detected; the quantitative analysis is realized in the low-concentration copper ion content cyanide-free silver plating liquid. The copper ion content is monitored in real time, so that the cyanide-free silver plating liquid can be treated when the copper ion content exceeds a certain concentration value (suggested value: 2g / L); the copper ion content is reduced; the influence on the plating layer quality of a plating element is prevented. In addition, when the cyanide-free silver plating liquid fast becomes blue, the result shows that the probability of generating production accidents such as no energization or plating element falling is great; the management on the plating liquid and the control on the product quality are convenient.

Description

technical field [0001] The invention belongs to the field of cyanide-free silver plating, and in particular relates to a cyanide-free silver plating electroplating solution capable of dynamically monitoring copper ion pollution content, a simple and rapid detection method and a quantitative detection method. Background technique [0002] Silver has a wide range of uses in industry and daily life. It is a high-tech metal, and it is also a military and civilian dual-use metal. The electroplated silver layer has a unique silvery white luster and is chemically stable. The electroplated silver layer has high electrical and thermal conductivity, and has good soldering performance. Electroplated silver is widely used in printed circuit boards and electronic components in the electronics industry, and in important parts of communication equipment and equipment such as instrumentation, aircraft, optical instruments, high-frequency components, and waveguides to ensure good electrical...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/46C25D21/12G01N21/78G01N21/31
CPCC25D3/46C25D21/12G01N21/314G01N21/78G01N2021/3155
Inventor 赵健伟孙志程娜
Owner JIAXING UNIV
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