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Wide lip seals for electroplating

A lip seal and lip seal technology, applied in the field of electroplating equipment, can solve problems such as difficult electrical connection and corrosive electroplating solution

Active Publication Date: 2022-07-12
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in some configurations, the conductive seed layer on the substrate contacted by the electrical connection may become thinner towards the edge of the substrate, making it more difficult to establish an optimal electrical connection to the substrate
[0004] Another problem that arises in electroplating is the potentially corrosive nature of the plating solution

Method used

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  • Wide lip seals for electroplating
  • Wide lip seals for electroplating
  • Wide lip seals for electroplating

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Embodiment Construction

[0013] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the concepts presented. The concepts presented may be practiced without some or all of these specific details. In other instances, well-known process operations have not been described in detail so as not to unnecessarily obscure the described concepts. While some concepts will be described in conjunction with specific embodiments, it should be understood that these embodiments are not intended to be limiting.

[0014] exist figure 1 An exemplary electroplating apparatus is shown in order to provide some context for the various lip seal and contact element embodiments disclosed herein. in particular, figure 1 A perspective view of a wafer holding and positioning apparatus 100 for electrochemically processing semiconductor wafers is shown. The apparatus 100 includes a wafer-bonding component, which is sometimes referred to as a "clamp-type component" ...

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Abstract

The present invention relates to wide lip seals for electroplating. Lip seals are designed for use in a lip seal assembly of an electroplating apparatus, where a clamp engages and supplies current to a semiconductor substrate during electroplating. The lip seal includes an elastomer having an outer portion configured to engage a cup of the lip seal assembly and an inner portion configured to engage a peripheral region of the semiconductor substrate. The inner portion includes protrusions having a radial width sufficient to provide an area of ​​contact with the semiconductor substrate, the protrusions inhibiting the diffusion of acid in the electroplating solution used during electroplating. The protrusions are located on the inner periphery of the lip seal.

Description

technical field [0001] The present invention relates to the formation of damascene interconnects for integrated circuits and electroplating equipment used during the manufacture of integrated circuits. Background technique [0002] Electroplating is a common technique used to deposit one or more layers of conductive metal in integrated circuit (IC) fabrication. In some fabrication processes, it is used to deposit single or multilevel copper interconnects between various substrate features. Electroplating equipment typically includes an electroplating bath with an electrolyte bath / bath and a fixture designed to hold the semiconductor substrate during electroplating. [0003] During operation of the electroplating apparatus, the semiconductor substrate is immersed in a bath of electrolyte such that one surface of the substrate is exposed to the electrolyte. One or more electrical contact elements established with the substrate surface are employed to drive an electrical curr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/12C25D17/00
CPCC25D7/12C25D17/001C25D17/004C25D7/123C25D17/007C25D17/06H01L21/2885
Inventor 卡利·托尔凯尔森亚伦·伯克桑托什·库马尔罗伯特·拉什蔡利鹏布赖恩·布卡卢
Owner LAM RES CORP
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