High-frequency integrated circuit module with integrated end-fire antenna and packaging method thereof
An integrated circuit and end-fire antenna technology, applied in the field of high-frequency integrated circuit chip packaging, can solve the problems of high cost, high cost, complex process, etc., and achieve the effect of solving the bottleneck problem, good quality consistency, and avoiding the wire bonding link.
Active Publication Date: 2021-03-05
成都中宇微芯科技有限公司
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] However, there are still technical bottlenecks in the packaging of high-frequency integrated circuits. The packaging technology currently used is either large in power loss, or complex in process, high in cost, and large in size, making it difficult to mass-produce and apply it commercially.
At present, the high-frequency integrated circuits that can be packaged in small batches are lower than the Ka-band (26.5GHz-40GHz) high-frequency integrated circuits. The input and output signals on the high-frequency integrated circuit chip are usually connected to the outside of the package shell by means of microstrip lines + glass insulators. This packaging method can only be packaged manually in small batches, and the packaging accuracy requirements and performance consistency can be guaranteed. At present, large-scale commercial integrated circuit packaging process lines cannot meet the requirements.
For higher frequency (>40GHz) integrated circuit chips, in order to control the power loss caused by the interconnection leads in the package, only complex and high-cost packages such as flip-chip soldering and embedded chip-level array ball bonding can be used. technology, or the packaging method of metal waveguide + quartz probe, but these methods cannot avoid problems such as high cost, large volume, and poor quality consistency, which limit the large-scale mass production and application of high-frequency integrated circuits
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0035] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0036] Such as figure 1 and figure 2As shown, Embodiment 1 of the present invention provides a high-frequency integrated circuit module with an integrated end-fire antenna, including a package case 11 and an integrated high-frequency integrated circuit chip 12 fixed on the package case 11. The integrated high-frequency integrated circuit Each electrode 123 of the circuit chip is bonded to each corresponding pad 111 of the packaging shell through a wire lead 16, and the integrated high-frequency integrated circuit chip 12 and the wire lead 16 are covered with a packaging layer 17, wherein the integrated type The high-frequency integrated circuit chip 12 is provided with a functional circuit 121 and an end-fire antenna as...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to the high frequency integrated circuit chip packaging technology field and particularly relates to a high frequency integrated circuit module integrated with an end-on-fire antenna and a packaging method thereof. The high frequency integrated circuit module comprises a packaging casing and an integrated high frequency integrated circuit chip fixed on the packaging casing, wherein the integrated high frequency integrated circuit chip is provided with a function circuit and an end-on-fire antenna assembly, and a high frequency output electrode of the function circuit anda high frequency input electrode of the end-on-fire antenna assembly are in mutual connection in the integrated high frequency integrated circuit chip. The function circuit and the end-on-fire antennaassembly are both arranged on the integrated high frequency integrated circuit chip, the high frequency output electrode of the function circuit and the high frequency input electrode of the end-on-fire antenna assembly are in mutual connection in the integrated high frequency integrated circuit chip during chip processing, electrical signals routing from the integrated high frequency integratedcircuit chip to a pad of the packaging casing are DC or low frequency electrical signals, the commercial low-cost packaging process can be utilized for packaging, and a bottleneck problem of high frequency integrated circuit chip packaging is solved.
Description
technical field [0001] The invention relates to the technical field of high-frequency integrated circuit chip packaging, in particular to a high-frequency integrated circuit module with an integrated end-fire antenna and a packaging method thereof. Background technique [0002] With the development of society and technological progress, high-frequency integrated circuits have received more and more attention, and become a hot spot in current research and applications, such as 5G communication, high-speed data transmission, automotive anti-collision radar, and even terahertz imaging systems, whose operating frequency ranges from 24GHz, 35GHz, 77GHz, to 140GHz or even 220GHz and above frequencies have corresponding application requirements. [0003] At present, the large-scale application of high-frequency integrated circuits in the design and processing has been solved technically. Whether it is a high-frequency integrated circuit designed and processed with III-V semiconduct...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & AuthorityPatents(China)
IPC IPC(8): H01L27/01H01L27/02H01L21/56
CPCH01L21/56H01L27/01H01L27/02H01L2224/05554H01L2224/48091H01L2224/49171H01L2224/73265H01L2924/181H01L2924/00012H01L2924/00014
Inventor唐海林
Owner成都中宇微芯科技有限公司