Camera module and its photosensitive components
A technology of photosensitive components and photosensitive elements, which is applied in the direction of electrical components, image communication, color TV parts, etc., and can solve the problems of large light transmission, small light transmission, and difficult demoulding, etc.
Active Publication Date: 2021-10-08
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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Problems solved by technology
[0005] Based on this, it is necessary to provide a camera module and its photosensitive component with a large light transmission and easy demoulding for the problem that the light transmission hole of the photosensitive component has a small light transmission due to structural defects and is not easy to be demoulded.
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[0041] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0042] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes ...
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The invention relates to a camera module and its photosensitive component. The photosensitive component includes: a substrate; a photosensitive element arranged on the substrate; The hole includes a first light through hole and a second light through hole. The side wall of the first light through hole extends vertically from the photosensitive element to the end connected to the second light through hole relative to the photosensitive element, and the side wall of the second light through hole extends from the end connected to the second light through hole. One end of the light through hole extends obliquely relative to the photosensitive element from one end to the upper surface; the outer wall of the package away from the photosensitive element extends obliquely from the lower surface to the upper surface away from the upper surface, and the inclination angle of the side wall of the second light through hole relative to the optical axis direction of the photosensitive element is 15~75°. The above photosensitive component, because the side wall of the second light through hole of the package extends obliquely and the inner diameter gradually increases in the direction away from the photosensitive element, so the amount of light irradiated on the photosensitive element increases, and can be conveniently used to form the package The molding mold is demoulded.
Description
technical field [0001] The invention relates to the field of camera modules, in particular to a camera module and a photosensitive component thereof. Background technique [0002] With the rapid development of various smart devices, smart devices integrated with camera modules are becoming more and more thin and light while improving the image quality. Improving the imaging quality means that the specifications and quantities of electronic components are constantly increasing, and the area of the photosensitive element that greatly affects the imaging quality is also constantly increasing. Therefore, the difficulty of assembling the camera module is constantly increasing. The overall size is also continuously increasing, so the thinning and lightening of the camera module is greatly restricted, thereby limiting the volume of the smart device equipped with the camera module. [0003] The commonly used camera module packaging process is the COB (Chip On Board) packaging pro...
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IPC IPC(8): H04N5/225
CPCH04N23/00H04N23/55
Inventor 庄士良冯军张升云黄春友唐东帅文华
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD