Camera module and photosensitive component thereof

Abstract

The invention relates to a camera module and a photosensitive component thereof. The photosensitive component comprises a substrate, a photosensitive element and a package body, wherein the photosensitive element is arranged on the substrate; the package body is encapsulated on the substrate, the package body comprises an upper surface away from the photosensitive element, and the package body isprovided with a light transmitting hole that penetrates through the package body and directly faces a photosensitive region of the package body; the light transmitting hole comprises a first light transmitting hole and a second light transmitting hole, the cross section of the first light transmitting hole is a stepped structure with a large upper part and a small lower part, the first light transmitting hole comprises a lower hole part close to the substrate and an upper hole part away from the substrate, the side wall of the second light transmitting hole obliquely extends from the top edgeof the upper hole part to the upper surface of the package body, and the inner diameter of the second light transmitting hole gradually increases in the current direction. According to the above photosensitive component, since the side wall of the second light transmitting hole of the package body obliquely extends and the diameter of the second light transmitting hole gradually increases in a direction away from the photosensitive element, the amount of light irradiated on the photosensitive element can be increased. And moreover, the side wall of the second light transmitting hole is inclined, so that the demolding of a forming die for forming the package body can be facilitated.

Description

[0001] This application claims the priority of the Chinese patent application with the application number 201710317509.2 and the title of the invention "camera module and its photosensitive component" filed on May 6, 2017. technical field [0002] The invention relates to the field of camera modules, in particular to a camera module and a photosensitive component thereof. Background technique [0003] With the rapid development of various smart devices, smart devices integrated with camera modules are becoming more and more thin and light while improving the imaging quality. Improving the imaging quality means that the specifications and quantities of electronic components are constantly increasing, and the area of ​​the photosensitive element that greatly affects the imaging quality is also constantly increasing. Therefore, the difficulty of assembling the camera module is constantly increasing. The overall size is also continuously increasing, so the thinning and lightenin...

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Problems solved by technology

[0006] Based on this, it is necessary to provide a camera module and its photosensitive component with a large light transmission and easy demoulding for the problem that the light transmission hole of the photosensitive component has a small light transmission due to structural defects and is not easy to be demoulded.

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