Air purification method for using air chip for releasing negative ions in certain scope

Abstract

The invention discloses an air purification method for using an air chip for releasing negative irons in a certain scope. Intelligent dust composed of a microprocessor, a bidirectional wireless receiving device and a wireless network is involved in the method. According to the intelligent dust, some motes are dispersed in a site through the wireless network and can locate one another, further collect data through the bidirectional wireless receiving device and transmit information to the microprocessor, and the microprocessor transmits the information to a cloud-side coefficient base of a basestation. The method also involves the air chip which is unstable in shape, and the air chip comprises a first electrode layer, a functional material layer, a second electrode layer, a third operatinglayer and a cloud-side transmission layer which are connected in sequence, and the third operating layer is used for high-level biologic simulation of the air chip and can extract an operation simulation function, simulate biologic nerve cells to complete high-intelligence operation and upload operation data to the cloud-side coefficient base for storage through the cloud-side transmission layer.The method also involves a negative ion air purifier, and an air chip placement cavity is formed in the negative ion purifier.

Description

technical field [0001] The invention belongs to the technical field and relates to a method for purifying air in a wide range by releasing negative ions through an air chip. Background technique [0002] Chip, also known as microcircuit (microcircuit), microchip (microchip), integrated circuit (English: integrated circuit, IC). Refers to a silicon chip containing an integrated circuit, which is small in size and is often part of a computer or other electronic equipment. An integrated circuit (English: integrated circuit, IC), or microcircuit (microcircuit), microchip (microchip), chip (chip) in electronics is a way to miniaturize circuits (mainly including semiconductor devices, including passive components, etc.), and is usually manufactured on the surface of a semiconductor wafer. The foregoing integrated circuits manufactured on the surface of a semiconductor chip are also called thin-film integrated circuits. Another kind of thick-film hybrid integrated circuit (hybrid...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for purifying the air in a wide range by releasing negative ions through the air chip, which solves the problem that the speed and power consumption of the end user increase significantly, and the manufacturer is faced with the sharp challenge of using better geometry, how to combine the chip with the air Combining and generating negative ions to achieve the problem of purifying the air