A fluorine-containing active ester, its preparation method, and its cured resin

Abstract

The invention provides a fluorine-containing active ester, which is an epoxy resin curing agent, has a specific chemical structure, and contains several fluorine-containing aromatic functional groups; its preparation method is: (a) combining fluorine-containing aromatic The primary phenol and the organic solvent are mixed according to the formula; (b) adding an esterification reaction agent to the fluorine-containing aromatic dihydric phenol solution, and then adding an alkaline catalyst solution for reaction; (c) adding an end-capping agent for reaction; (d) Washing, neutralization, and dehydration to obtain fluorine-containing active ester. The present invention also provides a resin-containing cured product, comprising 10-25 parts of the above-mentioned fluorine-containing active ester, 50-90 parts of polyolefin-modified epoxy resin, and 0.02-2 parts of a curing accelerator. The invention has the characteristics of reducing the dielectric constant and the dielectric loss tangent of the cured resin, realizing the improvement of the electrical performance, and satisfying the requirement of high-frequency signals.

Description

technical field [0001] The invention relates to a fluorine-containing active ester, a preparation method thereof, and a cured resin containing the same, belonging to the field of polymer materials. Background technique [0002] In recent years, as the speed of transmission signals in the interconnection medium of integrated circuits has increased, the frequency of signals has been increased. As the feature size of integrated circuits enters deep sub-micron, the interconnection RC delay has become an important factor affecting the speed of the circuit, which requires the interconnection medium of the integrated circuit to have a low dielectric constant and a low dielectric loss tangent to meet the requirements of high-frequency signal transmission. Need, but also need to have good insulation, heat resistance and adhesion, based on the above requirements, usually a cured product of a thermosetting resin cured product, and an epoxy resin cured product containing an epoxy compou...

AI Technical Summary

Problems solved by technology

However, due to the large number of hydroxyl groups in the resin structure of the epoxy resin itself, as well as the large number of hydroxyl groups produced by the general curing agent and epoxy ring-opening crosslinking, the cured product of the composition will have a higher dielectric constant and dielectric loss tangent. Therefore, it cannot meet the requirements of high frequency signal

Images