Method of connecting two types of chips on lead frame
A lead frame and the technology of the lead are applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., and can solve problems such as process blanks
Active Publication Date: 2019-04-19
沈阳中光电子有限公司
View PDF7 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, there is currently a demand in the market to mount two types of chips on the same lead frame at the same time to produce products that perform two physical quantity sensing tasks at the same time, and the chips that realize these two functions require different placement modes. , therefore, the technology of this product is still blank for the time being
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0037] To overcome the deficiencies in the prior art, the invention provides a method for connecting two types of chips on a lead frame. In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be described in more detail below with reference to the drawings in the preferred embodiments of the present invention. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of the invention. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative eff...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a method for connecting two types of chips on a lead frame. The method comprises the following steps: mounting a bonding chip at the top end of the lead frame; spraying gold liquid on the top of the lead frame, so that a gold wire, one end of which is connected with the bonding chip and the other end of which is connected with the lead frame, is formed on the top of the lead frame; dispensing glue at the gold wire through low-fluidity silica gel, so that the gold wire is fixed on the lead frame; installing an SMD chip at the spot soldering position of the lead frame through reflow soldering, and enabling the SMD chip to be connected with the gold wire; and packaging the bonding chip, the SMD chip and the gold wire on the lead frame to complete the connection of thebonding chip and the SMD chip on the lead frame. The bonding chip and the SMD chip can be used on the same lead frame at the same time, and the blank that the chips with the two functions cannot be used on the same lead frame is filled.
Description
technical field [0001] The invention belongs to the technical field of optoelectronic semiconductor preparation, and in particular relates to a method for connecting two types of chips on a lead frame. Background technique [0002] Lead frame is still one of the important structural carriers of optoelectronic semiconductor products, but products with lead frame structure often cannot mount chips with more than one function. Traditional lead frame products generally only use one mode of bonding (die bonding+wire bonding) for patching. Recently, SMT technology can also meet the needs of mounting SMD chips on lead frames. However, there is currently a demand in the market to mount two types of chips on the same lead frame at the same time to produce products that perform two physical quantity sensing tasks at the same time, and the chips that realize these two functions require different placement modes. Therefore, the technology of this product is still blank for the time bei...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/495H01L25/18
CPCH01L21/4821H01L21/4839H01L23/49575H01L25/18H01L2224/48091H01L2224/48247H01L2924/00014
Inventor 罗欣熠
Owner 沈阳中光电子有限公司