A method of connecting two types of chips on a lead frame
A lead frame and the technology of the lead are applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., and can solve problems such as process blanks
Active Publication Date: 2021-05-11
沈阳中光电子有限公司
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Problems solved by technology
However, there is currently a demand in the market to mount two types of chips on the same lead frame at the same time to produce products that perform two physical quantity sensing tasks at the same time, and the chips that realize these two functions require different placement modes. , therefore, the technology of this product is still blank for the time being
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[0037] In order to overcome the deficiencies in the prior art, the invention provides a method for connecting two types of chips on a lead frame. In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be described in more detail below with reference to the drawings in the preferred embodiments of the present invention. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of the invention. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without cre...
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The invention discloses a method for connecting two types of chips on a lead frame, comprising: installing a bonding chip on the top of the lead frame; spraying liquid gold on the top of the lead frame to form an end at the top of the lead frame A gold wire connected to the bonding chip and the other end connected to the lead frame; dispensing glue at the gold wire through low fluidity silica gel, so that the gold wire is fixed on the lead frame; Reflow soldering installs the SMD chip on the spot solder position of the lead frame, and connects the SMD chip to the gold wire; the bonding chip, the SMD chip, and the gold wire are packaged on the lead frame, Complete the connection of the bonding chip and the SMD chip on the lead frame. The invention enables the bonding chip and the SMD chip to be used on one lead frame at the same time, and fills the gap that the chips with these two functions cannot be used on the same lead frame.
Description
technical field [0001] The invention belongs to the technical field of optoelectronic semiconductor preparation, and in particular relates to a method for connecting two types of chips on a lead frame. Background technique [0002] Lead frame is still one of the important structural carriers of optoelectronic semiconductor products, but products with lead frame structure often cannot mount chips with more than one function. Traditional lead frame products generally only use one mode of bonding (die bonding+wire bonding) for patching. Recently, SMT technology can also meet the needs of mounting SMD chips on lead frames. However, there is currently a demand in the market to mount two types of chips on the same lead frame at the same time to produce products that perform two physical quantity sensing tasks at the same time, and the chips that realize these two functions require different placement modes. Therefore, the technology of this product is still blank for the time bei...
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IPC IPC(8): H01L21/48H01L23/495H01L25/18
CPCH01L21/4821H01L21/4839H01L23/49575H01L25/18H01L2224/48091H01L2224/48247H01L2924/00014
Inventor 罗欣熠
Owner 沈阳中光电子有限公司