Circuit board and a manufacturing method

Abstract

The invention discloses a circuit board. The circuit board includes a substrate; the substrate has at least one first surface, conductive lines, at least one metal layer and plating; the conductive lines are arranged on the first surfaces; each conductive line has a second surface away from the substrate and two side surfaces; each side surface is simultaneously connected to the first and second surfaces; each metal layer is combined with the corresponding second surface, the two side surfaces and the area of the corresponding first surface adjacent to each side surface; and the plating is combined with the surfaces, away from the substrate, of the metal layers and the surfaces of the conductive lines. Through the tight combination of the metal layers coated on the surfaces of the conductive lines and the substrate and the tight combination of the plating coated on the surfaces of the metal layers and the metal layers, the conductive lines can be tightly wrapped, so that the conductivelines cannot be corroded because of exposing. In addition, a manufacturing method of the circuit board is also provided.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method of the circuit board. Background technique [0002] At present, the use of circuit boards is becoming more and more widespread. Existing circuit boards generally include a substrate layer, a conductive circuit bonded to the surface of the substrate layer, and a plating layer coated on the surface of the conductive circuit. The plating layer is generally a nickel-gold layer, a palladium-gold layer, etc., which are used to prevent the conductive lines of the circuit board from being corroded. [0003] However, although the plating layer of the existing circuit board covers the conductive circuit, there will always be a gap between the plating layer and the base layer and cannot be in close contact. Materials such as corrosive gases can contact the conductive circuit from the gap, and the conductive The wiring is corroded. [0004] In addition, after the circuit board is manufactured, ...

AI Technical Summary

Problems solved by technology

However, the gap between the plating layer and the substrate layer in the circuit board can expose the conductive circuit to the environment of the above-mentioned corrosion resistance test, so that the exposed copper, nickel and other metals in the gap will inevitably be corroded

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