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Camera module and array camera module based on integrated packaging technology

A camera module and an integrated technology, applied in the direction of image communication, color TV parts, TV system parts, etc., can solve the problems of damaged filters, easy-to-touch filters, increasing the back focus of the lens, etc.

Active Publication Date: 2021-05-04
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this structure, on the one hand, the optical filter 4 needs to be coordinated with other components such as the lens or the driver to coordinate the allocation of the packaging part. In this case, the installation accuracy is relatively high, and other components are easy to damage the filter during installation. light sheet; on the other hand, the optical filter is relatively close to the distance from the lens, and the lens in the lens is easy to touch the optical filter, and increases the back focal length of the lens

Method used

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  • Camera module and array camera module based on integrated packaging technology
  • Camera module and array camera module based on integrated packaging technology
  • Camera module and array camera module based on integrated packaging technology

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Embodiment Construction

[0215] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0216] Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention...

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Abstract

A camera module and an array camera module based on an integrated packaging process, the camera module includes: a circuit board (212), an integrated base (211), a photosensitive element (220), a lens (230), and a filter element mirror holder (240) and the filter element (250) that is installed in the filter element mirror seat; The filter element mirror seat (240) is supported on at least a part of the top surface (2113) of the integral base, and the filter element mirror seat (240) ) cooperates with the integrated base (211) to form a light window (2111) to provide a light path for the photosensitive element (220); wherein the integrated base (211) is integrally packaged on the circuit board (212) and the photosensitive element (220) and includes Buried the photosensitive element connector (221), the circuit board connector (222) and the connecting wire (223), and made the inner edge of the top surface (2113) of the integrated base (211) and the optical axis of the camera module The distance is not greater than the distance between the outer edge of the circuit board connector (222) and the optical axis of the camera module, so that the top surface (2113) of the integrated base (211) provides a larger installation surface.

Description

technical field [0001] The present invention relates to the field of camera modules, and further relates to a camera module and an array camera module based on an integrated packaging process. Background technique [0002] Camera modules are one of the indispensable components of smart electronic devices, such as but not limited to smart phones, cameras, computer equipment, wearable devices and other smart electronic devices. With the continuous development and popularization of various smart devices, the requirements for camera modules are also getting higher and higher. [0003] In recent years, smart electronic devices have developed by leaps and bounds and tend to be thinner and lighter. To adapt to this development, camera modules are increasingly required to be multi-functional, thinner, and miniaturized, so that smart electronic devices can be made more and more Thinner and thinner, and meet the imaging requirements of the device for the camera module. Therefore, ca...

Claims

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Application Information

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IPC IPC(8): H04N5/225
CPCH04N23/54H04N23/57H04N23/55
Inventor 王明珠赵波杰陈振宇郭楠田中武彦
Owner NINGBO SUNNY OPOTECH CO LTD