3D packaging structure based multifunctional phased array TR chip

Abstract

The invention discloses a 3D packaging structure based multifunctional phased array TR chip. A chip RF part with a high-performance gallium arsenide chip comprises four identical single channels, namely, first to fourth channels CH1, CH2, CH3 and CH4, the four single channels are connected with four ports of a one-to-four power divider respectively, and each channel comprises a six-bit digital control attenuator ATT, a six-bit digital control phase shifter PHS, a low noise amplifier LNA, a driving amplifier DRV1, a driving amplifier DRV2, a power amplifier PA, a single-pole three-throw switchSP3T and a limiter Limiter; and a CMOS chip services as a control circuit of the multifunctional chip for chip logic control, and the CMOS chip and the gallium arsenide multifunctional chip are arranged in a flip way to form the integrated 3D packaging structure. The 3D packaging structure based multifunctional phased array TR chip has the advantages of small size, low cost, high consistency, highreliability and simple debugging.

Description

technical field [0001] The invention belongs to the technical field of integrated circuits, and in particular relates to a multifunctional phased array TR chip based on a three-dimensional packaging structure. Background technique [0002] Phased array radar is an advanced radar system, based on phased array antenna, using a variety of high-tech products. In the 1960s, in order to meet the needs of surveillance, tracking and identification of space targets such as artificial satellites and intercontinental ballistic missiles, large-scale phased array radars for strategic defense systems came into being. Due to the extremely high cost of developing large-scale phased array radars, only the United States, the Soviet Union and other countries developed a few practical radars in the early days. [0003] With the improvement of the performance of various aircraft as the radar observation object and the complexity of the radar target environment, in order to extract more informat...

AI Technical Summary

Problems solved by technology

Traditional T / R components require a large number of chips, a large number of microstrip transmission lines, chip carrier boards, capacitors and resistors, metal compartments, etc., making it difficult to make their volume small. Considering that phased array radar contains thousands of Tens of thousands of T / R components, if the traditional T / R component technology is used, the volume and weight of the phased array radar will be very large, which will seriously affect the portability and ease of use of the equipment

[0007]2. High cost

Traditional T / R component technology requires a large number of microwave chips, a large number of microstrip transmission lines, chip carrier boards, capacitors, resistors and metal compartments, plus manual debugging and micro-assembly, the cost is very high

[0008] 3. Poor consistency

In the microwave and millimeter wave frequency bands, performance indicators such as the amplitude, phase, phase shifting accuracy, and attenuation accuracy of traditional T / R components are seriously affected by chip cascading, gold wire, transmission line length, and micro-assembly assembly process, and the consistency of performance is relatively high. Poor, which seriously affects the performance of phased array radar

[0009] 4. Poor reliability

Traditional T / R components have a large number of microstrip transmission lines, chip carrier boards, capacitors and resistors, metal compartments, gold wires, etc. Any problem with the radar during use will lead to deterioration of the performance of the T / R channel

[0010] 5. Requires a lot of debugging work

Because the performance consistency of traditional T / R components is difficult to guarantee, it is difficult to meet the consistency requirements of the phased array system after assembly, so engineers need to do a lot of debugging work on T / R components, and need to invest a lot of time and effort , seriously affecting the production efficiency of phased array radar

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