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Fragment integrated bonding device and method

A bonding method and fragmentation technology, which can be applied to attack equipment, warheads, projectiles, etc., can solve the problems that bonding equipment cannot achieve integrated bonding and the bonding method is inefficient, and achieve a simple structure and improve bonding efficiency. , the effect of low cost

Active Publication Date: 2020-04-03
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an integrated bonding device and method for fragments, in order to solve the problems that the existing bonding methods are inefficient and bonding equipment cannot achieve integrated bonding

Method used

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  • Fragment integrated bonding device and method

Examples

Experimental program
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Effect test

Embodiment 1

[0044] refer to figure 1 , figure 2 , image 3As shown, one embodiment of the present invention is an integrated bonding device for fragments, the device includes a support sleeve 1, a vertical isolation plate 2, and an isolation sleeve 3; the above support sleeve 1 is used to wrap the shell; the support sleeve 1 and the shell The gap between the bodies A forms an available space for arranging the fragments by the vertical isolation plate 2; the above-mentioned vertical isolation plate 2 is installed on the inner wall of the support sleeve 1; the above-mentioned isolation sleeve 3 is provided with a groove 301, and the above-mentioned groove 301 Matching with the vertical isolation plate 2, it is used to separate the fragments from the isolation sleeve 3 to prevent the fragments from directly contacting the shell. Partition the fragments to prevent the fragments from directly contacting the shell; and there is also a certain gap between the spacer 3 and the outer wall of th...

Embodiment 2

[0049] Based on the above examples, refer to Figure 4 , Figure 5 , Figure 6 As shown, another embodiment of the present invention is,

[0050] The above-mentioned device also includes a diverter plate 5, the above-mentioned diverter plate 5 includes a partition plate 501, a rotating disc 502, and a strip plate 503, and the above-mentioned split disc 501 is used to install the housing on the top, and the above-mentioned rotating disc 502 is installed on the upper end of the split disc 501. The strip plate 503 is installed on the rotating disk 502, and is used to drive the strip plate 503 to rotate and contact the fragments by the rotating disk 502; wherein the diverter plate 5 is located on the shell A, and is fixedly connected to the upper end of the shell A by the dividing plate 501 to divide The disk 501 is connected with the housing A by a key; its rotating disk 502 is placed on the upper end of the dividing disk 501, and its dividing disk 501 is fixedly connected with...

Embodiment 3

[0055] Based on the above examples, refer to Figure 7 , Figure 8 , Figure 9 As shown, another embodiment of the present invention is that, in order to quickly arrange the fragments in the vertical direction, the above-mentioned vertical separation plate 2 is in a convex shape, and the above-mentioned vertical separation plate 2 is two or more, and adjacent The gap between the two vertical isolation plates 2 is the same, and the gap is greater than or equal to the width of the fragment. The above-mentioned isolation sleeve 3, support sleeve 1 and vertical isolation plate 2 form an arrangement track 4, which is used to fill the fragments by the arrangement track 4. The vertical isolation plate 2 is evenly distributed on the support sleeve 1, the outer wall of the isolation sleeve 3, the inner wall of the support sleeve 1 and the side wall of the vertical isolation plate 2 form an arrangement track 4, and the fragments are placed in the arrangement track 4 by putting fragment...

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Abstract

The invention discloses an integrated bonding device and method for fragments. The device includes a support sleeve, a vertical isolation plate, and an isolation sleeve; the support sleeve is used to wrap the casing; the vertical isolation plate is installed on the inner wall of the support sleeve; the isolation sleeve There are grooves on the top, the above grooves coincide with the vertical isolation plates, and are used to isolate the fragments from the isolation sleeve to prevent the fragments from directly contacting the shell, and are used to arrange the fragments by the vertical isolation plates. The radial direction of the above vertical isolation plates The width and the like are adapted to the thickness of the fragments, in order to solve the problems that the existing bonding methods are inefficient and the bonding equipment cannot achieve integrated bonding.

Description

technical field [0001] The invention relates to bonding of special fragments, in particular to an integrated bonding device and method for fragments. Background technique [0002] Special fragment bonding, by bonding the fragments to the shell body, when the shell explodes, the shock wave drives the fragments to scatter to improve the destructive power of the blast. The machine glues the surface of the fragments, and finally sticks the fragments on the shell; [0003] In the process of the fragments sticking to the shell, in order to achieve the purpose of the compact fit of the fragments and the shell, it is necessary to try to make the speed of the fragments at the bonding point of the fragments and the shell coincide with the circumferential speed of the shell rotation, and then There is a certain extrusion force between the fragment and the shell; the shell needs to have two degrees of freedom of rotation and up and down movement on the station; specifically, after the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F42B12/56F42B33/00
CPCF42B12/56F42B33/00
Inventor 李文强孙宏彪李彦陶冶凌思彤赵武程子豪
Owner SICHUAN UNIV
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