Variable-scale driving bionic dry adhesion mechanism

Abstract

The invention discloses a variable-scale driving bionic dry adhesion mechanism. The mechanism comprises a wedge-shaped seta beam unit, a tangential loading unit, a variable-scale driving transmissionunit, a normal driving unit and a supporting outer frame, the wedge-shaped seta beam unit is used for contacting and adhering a target object, the tangential loading unit is used for carrying out tangential loading / unloading on the wedge-shaped seta beam, the variable-scale driving transmission unit transmits the driving displacement and the driving force to the tangential loading unit, the normaldriving unit serves as an active driving source of the mechanism and is used for loading / unloading the variable-scale driving transmission unit, and the supporting outer frame is used for supportingthe whole mechanism and keeping the relative positions of all parts of the whole mechanism. According to the variable-scale driving bionic dry adhesion mechanism, a traditional point loading mode is converted into a surface loading mode, stable tangential loading / unloading of the wedge-shaped seta beam under micro-displacement is realized through a variable-scale driving principle, so that the application requirements of space fragment cleaning and flexible circuit board nondestructive operation are met.

Description

technical field [0001] The invention relates to the cleaning of space debris, the non-destructive handling of high-precision flexible electronic components and the development of special assembly manipulators, etc., and in particular to a variable-scale drive bionic dry adhesion mechanism. Background technique [0002] With the rapid development of aerospace technology in various countries, there are countless space debris in the earth orbit. The existence of space debris poses a serious threat to spacecraft in orbit. Once the space debris collides with the spacecraft, the loss caused is immeasurable; Flexible circuit boards have the advantages of light weight, thin thickness, and high flexibility, and their utilization rates in various industries have been greatly improved; therefore, how to clean up various space debris and realize fine and non-destructive operations on flexible circuit boards has become a hot research Direction is also the research target of the present i...

AI Technical Summary

Problems solved by technology

However, it is also found in the research that since the tendon wire is loaded by point contact, and there are inevitably assembly errors in practice, it is easy to introduce interference such as out-of-plane torque and peeling torque, resulting in poor operational stability of the adhesion device.

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