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Method of Forming Photonic Devices

A technology of photonic devices and recessed areas, which is applied in the fields of optical components, semiconductor/solid-state device manufacturing, instruments, etc., and can solve problems that affect the performance of photonic devices and the manufacturing methods of photonic devices are not completely satisfactory.

Active Publication Date: 2021-06-01
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such techniques cause various problems, for example, unwanted residues (e.g., reacted photoresist material) remain in the formed comb structures, which adversely affects the performance of photonic devices.
Therefore, existing photonic devices and their fabrication methods are not entirely satisfactory

Method used

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  • Method of Forming Photonic Devices
  • Method of Forming Photonic Devices
  • Method of Forming Photonic Devices

Examples

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Embodiment Construction

[0016] The following disclosure provides many different embodiments or examples for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, in the following description, forming a first component on or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which an additional component may be formed between the first component and the second component. components so that the first component and the second component may not be in direct contact with each other. In addition, the present invention may repeat reference numerals and / or characters in various embodiments. This repetition is for the sake of simplicity and clarity and does not in itself indicate a relationship betwe...

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Abstract

A method comprising: forming a plurality of first layers, each layer including a first dummy layer and a second dummy layer positioned over a substrate, wherein, within each layer, the second dummy layer is disposed on the first dummy layer above; forming a plurality of second recessed regions in a plurality of first layers, wherein at least a subset of the plurality of second recessed regions respectively extend through a different number of second dummy layers; and through a plurality of second dummy layers Etching is performed on at least a subset of the second recessed regions to simultaneously form a plurality of third trenches each having a different depth. Embodiments of the invention relate to methods of forming photonic devices.

Description

technical field [0001] Embodiments of the invention relate to methods of forming photonic devices. Background technique [0002] In today's telecommunications networks, optical fibers are often chosen over electrical cables to carry information in the form of light from one place to another, due in part to various advantageous characteristics of optical fibers, such as their Higher bandwidth, longer transmission distance, etc. [0003] In order to further increase the bandwidth of an optical fiber, a technique of multiplexing a plurality of optical signals on one optical fiber by using light of corresponding different wavelengths has been proposed, for example, a Dense Wavelength Division Multiplexing (DWDM) technique. Typically, photonic devices (eg, modulators) coupled to optical fibers are typically used to differentiate (eg, split) multiple optical signals by diffracting them using a grating. For example, a photonic device may comprise a plurality of gratings, each for...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/136
CPCG02B6/136G02B5/1819G02B5/1857G02B6/1225H01L21/3086H01L21/30608
Inventor 刘陶承洪蔡豪郭仕奇
Owner TAIWAN SEMICON MFG CO LTD