A method for manufacturing a display panel, a display panel, and a display device
A display panel and thermal separation technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as weak adhesion, separation, and poor display
Active Publication Date: 2022-04-05
BOE TECH GRP CO LTD
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Problems solved by technology
The OLED display device in the prior art includes an OLED device and a pixel definition layer between the OLED devices. The OLED device includes a light-emitting (EL) material, and the EL material is produced by evaporation or printing process. The EL material is also formed on the layer, but the adhesion between the EL material and the adjacent film layer is weak. In the folding display, the EL material is easily separated from the adjacent film layer as the number of folds increases. (Peeling), resulting in poor display
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Embodiment Construction
[0034] The embodiment of the present application provides a method for preparing a display panel, such as figure 1 As shown, the method includes:
[0035] S101, forming a pixel defining structure layer having an opening area and a non-opening area on the substrate, and forming a groove in the non-opening area and on the surface of the pixel defining structure layer away from the substrate;
[0036] S102, filling the glue material into the groove;
[0037] S103, forming an organic functional layer at least in the opening area, wherein the organic functional layer is in contact with the adhesive material;
[0038] S104, forming a cathode layer on the organic functional layer;
[0039] S105. Removing the adhesive material, and simultaneously removing the organic functional layer in contact with the adhesive material and the cathode layer located on the organic functional layer in contact with the adhesive material;
[0040] S106, forming an encapsulation layer covering the cat...
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Abstract
The present application discloses a method for preparing a display panel, a display panel and a display device, which are used to reduce the risk of separation of adjacent film layers. An embodiment of the present application provides a method for manufacturing a display panel, the method comprising: forming a pixel definition structure layer having an opening area and a non-opening area on a substrate, and forming a layer in the non-opening area and in the pixel forming a groove on the surface of the defined structure layer away from the substrate; filling the groove with glue; forming an organic functional layer at least in the opening area, wherein the organic functional layer is in contact with the glue; A cathode layer is formed on the organic functional layer; the adhesive is removed, and the organic functional layer in contact with the adhesive and the cathode layer located on the organic functional layer in contact with the adhesive are simultaneously removed ; forming an encapsulation layer covering the cathode layer and the pixel definition structure layer.
Description
technical field [0001] The present application relates to the field of display technology, in particular to a method for preparing a display panel, a display panel and a display device. Background technique [0002] Organic Light-Emitting Diode (OLED) devices have become extremely competitive due to their advantages such as high brightness, full viewing angle, fast response speed, thinness, wide operating temperature range, and flexible display. and development prospects of display technology. Due to the above-mentioned advantages, OLED display devices are gradually being applied to folding displays. The OLED display device in the prior art includes an OLED device and a pixel definition layer between the OLED devices. The OLED device includes a light-emitting (EL) material, and the EL material is produced by evaporation or printing process. The EL material is also formed on the layer, but the adhesion between the EL material and the adjacent film layer is weak. In the fold...
Claims
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IPC IPC(8): H01L51/56H01L51/52H01L27/32
CPCH10K59/122H10K59/12H10K50/82H10K50/84H10K71/00
Inventor 李晓虎康亮亮焦志强
Owner BOE TECH GRP CO LTD