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Method of transferring structures

A structure and removal technology, applied in the fields of electrical solid state devices, semiconductor devices, semiconductor/solid state device manufacturing, etc., can solve problems such as lack of flexibility

Active Publication Date: 2020-01-17
COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] Finally, extension only enables similar rearrangements of structures, thus offering little flexibility in rearrangements of structures during the transfer step

Method used

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Embodiment Construction

[0067] The invention relates to a method of transferring structures onto the face of a master substrate, called the master face.

[0068] In particular, the transfer step makes use of a support layer with regions that can be folded and unfolded (advantageously in a reversible manner), making it possible to vary the spacing of the structures by transferring them onto the host substrate.

[0069] According to the invention, the folding and unfolding of the support layer is carried out by the action of an external stimulus. Specifically, external excitation can change the stress state of the support layer, whereby the folding and unfolding process takes place in the folded region.

[0070] Figure 2a-2b , 3a-3d, 4a-4f, 5 and 6a-6b schematically show the different steps of the method for transferring structures according to the invention.

[0071] In particular, the method according to the invention comprises a step a) of providing a support layer 100 comprising two substantiall...

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PUM

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Abstract

The present invention relates to a transfer method comprising: a) providing a support layer (100) comprising a first face, on which structural bodies (200) are bonded by their front faces (110); and c) transferring the structure (200) onto the main surface of the main substrate. The supporting layer (100) comprises a folding area (101) located between the structural bodies (200), and is adjusted to change from a folded state to an unfolded state under the effect of an external excitation. The method comprises, between steps a) and c), a step b) of performing an external action such that the folded region changes from the folded state to the unfolded state in order to change the spacing between the structures (200).

Description

technical field [0001] The invention relates to a method for transferring a structure onto a main surface of a main substrate. In particular, the invention utilizes a support layer provided with foldable and expandable regions, making it possible to vary the spacing between structures. Background technique [0002] Methods known in the prior art for transferring constructs are described in document [1] cited at the end of the description and shown in figure 1 Middle a to c. [0003] The method known in the prior art comprises, inter alia, the following successive steps: [0004] a) Provide a temporary substrate 1, the temporary substrate 1 includes two substantially parallel main faces (main faces), respectively referred to as the first face 1a and the second face 1b, the temporary substrate 1 is extendable (stretchable), multiple structures bodies 2 are joined on a first face along one of their faces, called the front face; [0005] B) extending the temporary substrate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L33/00H10K99/00
CPCH01L33/0095H01L21/6835H01L2221/68304H01L2221/68354H01L21/6836H01L24/83H01L24/95H01L25/0753H01L25/50H01L33/62H01L2933/0066H01L2221/68368H01L2224/95001H01L2924/12041H10K71/18
Inventor 拉米·贝纳萨伊斯梅尔·德吉尔门西奥格卢
Owner COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
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