Metallized half-hole PCB flash processing method

A metallized semi-hole and etching technology, which is applied in chemical/electrolytic methods to remove conductive materials, printed circuits, electrical components, etc., can solve problems such as weak solder feet, bridging short circuits, and virtual soldering, and improve production efficiency. , Guarantee quality, improve the effect of survival efficiency

Pending Publication Date: 2020-05-12
惠州市永隆电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if there are copper wires remaining in these semi-metallized holes, when the SMT manufacturer performs welding, it will lead to weak soldering and false soldering; seriously cause a bridge short circuit between the two pins

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for metallized half-hole PCB batch front processing is characterized in that it includes the following method: setting the etching compensation value of the independent PAD of the new thick copper plate, and when designing the circuit film, make a The corresponding etch compensation value is copper-free.

[0026] Further, it also includes adding a new drilling device, a transfer device, an etching device, and an information processing terminal and connecting them to each other, and connecting the transfer device and the etching device through the information processing terminal to perform etching.

[0027] Further, the following processes are also included: copper sinking - dry film - electroplating - film removal - gong board - film removal etching - AOI - solder resist ink - board separation - tin spraying - normal post-process.

[0028] Further, the gap between the position of the PAD to be drilled and the diameter of the drilled hole after etching is + Wit...

Embodiment 2

[0034] A method for metallized half-hole PCB batch front processing is characterized in that it includes the following method: setting the etching compensation value of the independent PAD of the new thick copper plate, and when designing the circuit film, make a The corresponding etch compensation value is copper-free.

[0035] Further, it also includes adding a new drilling device, a transfer device, an etching device, and an information processing terminal and connecting them to each other, and connecting the transfer device and the etching device through the information processing terminal to perform etching.

[0036] Further, the following processes are also included: copper sinking - dry film - electroplating - film removal - gong board - film removal etching - AOI - solder resist ink - board separation - tin spraying - normal post-process.

[0037] Further, the gap between the position of the PAD to be drilled and the diameter of the drilled hole after etching is + Wit...

Embodiment 3

[0043] A method for metallized half-hole PCB batch front processing is characterized in that it includes the following method: setting the etching compensation value of the independent PAD of the new thick copper plate, and when designing the circuit film, make a The corresponding etch compensation value is copper-free.

[0044] Further, it also includes adding a new drilling device, a transfer device, an etching device, and an information processing terminal and connecting them to each other, and connecting the transfer device and the etching device through the information processing terminal to perform etching.

[0045] Further, the following processes are also included: copper sinking - dry film - electroplating - film removal - gong board - film removal etching - AOI - solder resist ink - board separation - tin spraying - normal post-process.

[0046] Further, the gap between the position of the PAD to be drilled and the diameter of the drilled hole after etching is + Wit...

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PUM

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Abstract

The invention belongs to the technical field of PCB processing, and provides a metallized half-hole PCB flashing processing method. The method comprises the following steps of: setting an etching compensation value of a new thick copper plate independent PAD, and performing copper-free processing on the corresponding etching compensation value according to the position of the PAD needing to be drilled when a circuit film is designed. According to the method, the phenomenon that a half-hole copper sheet is rolled up can be avoided, so that adverse effects on the product due to no copper in thehalf hole and warping of the half-hole copper sheet are avoided, and the product quality requirement is met.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a method for processing metallized half-hole PCB fronts. Background technique [0002] After the semi-metallized hole is formed, the copper skin on the hole wall is lifted and the problem of the edge remaining has always been a difficult problem in the machining of PCB boards. The copper wires and caps remaining in the semi-metallized holes are prone to problems such as weak solder joints, virtual soldering, and bridging short circuits during the soldering process of downstream SMT manufacturers. [0003] How to control the copper skin on the hole wall after the semi-metallized hole is formed, and the generation of the edge residue has always been a difficult problem in the machining of PCB boards. This is because the general mechanical processing methods for PCB forming are nothing more than CNC gong bed gong boards, mechanical punching punching and other m...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0044H05K3/0047H05K3/06
Inventor叶钢华吴永强
Owner惠州市永隆电路有限公司