A thermal simulation device and method

Abstract

The invention relates to a thermal simulation device and method, belonging to the technical field of simulation. The device includes an electronic system and a control device, the electronic system includes a plurality of power control devices, each power control device is used to simulate a corresponding heat generating device, and each power control device includes a power supply, a thermal resistance and a switch control unit, wherein the power supply , the thermal resistance and the switch control unit are electrically connected to form a loop; and a control device for generating a plurality of different PWM signals and sending the plurality of different PWM signals to the switch control unit, wherein by changing the duty cycle of the PWM signal to change the effective voltage across the RTD. The invention can effectively simulate the power consumption of different devices in the electronic system, thereby accurately expressing the temperature field change in the electronic system, improving the thermal design efficiency of the complex electronic system, and preventing the temperature field in the actual electronic system from exceeding the normal equipment operating temperature range.

Description

technical field [0001] The invention relates to the technical field of simulation, and in particular, to a thermal simulation device and method. Background technique [0002] As the number and integration of devices in an electronic system become higher and higher, and the electronic system becomes more and more complex, the problem of device heating in a complex electronic system has become a key point that cannot be ignored. For example, high temperatures can cause electronic systems to run erratically, shorten their lifespan, and possibly even burn out certain components. The heat that causes the high temperature does not come from outside the electronic system, but from the inside of the electronic system, or inside the integrated circuit. Therefore, before designing an electronic system, the thermal simulation of the electronic system has guiding significance for designers to consider whether to install a heat sink when designing the electronic system. [0003] Genera...

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Problems solved by technology

[0005] In view of the above analysis, the present invention aims to provide a thermal simulation device and method to solve the problem that the current software simulation of complex electronic systems is difficult to give the exact boundary conditions of the simulation model, resulting in a large influence of the mesh size on the simulation results , and the software thermal simulation results are difficult to accurately express the actual electronic system temperature field changes

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