Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Thermal simulation device and method

A technology of thermal simulation and generation device, applied in the field of simulation, can solve the problem that the mesh size and simulation results have a great influence, it is difficult to give the exact boundary conditions of the simulation model, and the thermal simulation results are difficult to accurately express the temperature field change of the electronic system, etc. problem, to achieve the effect of improving thermal design efficiency

Active Publication Date: 2020-06-02
BEIJING RES INST OF MECHANICAL & ELECTRICAL TECH
View PDF14 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above analysis, the present invention aims to provide a thermal simulation device and method to solve the problem that the current software simulation of complex electronic systems is difficult to give the exact boundary conditions of the simulation model, resulting in a large influence of the mesh size on the simulation results , and the software thermal simulation results are difficult to accurately express the actual electronic system temperature field changes

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermal simulation device and method
  • Thermal simulation device and method
  • Thermal simulation device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of the application and together with the embodiments of the present invention are used to explain the principle of the present invention and are not intended to limit the scope of the present invention.

[0032] Semi-physical thermal simulation is a technology that connects the controller (physical object) with the simulation model (see mathematical simulation) of the control object realized on the computer for experimentation. In this test, the dynamic characteristics, static characteristics and nonlinear factors of the controller can be truly reflected, so it is a simulation test technology that is closer to reality. The embodiment of the present invention is a modified thermal simulation device of hardware-in-the-loop simulation.

[0033] A specific embodiment of the present invention discl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a thermal simulation device and method, and belongs to the technical field of simulation. The device comprises an electronic system and control equipment. The electronic system comprises a plurality of power control devices. Each power control device is used for simulating a corresponding heat generation device, each power control device comprises a power supply, a thermalresistor and a switch control unit, wherein the power supply, the thermal resistor and the switch control unit are electrically connected to form a loop; and the control equipment is used for generating a plurality of different PWM signals and transmitting the plurality of different PWM signals to the switch control unit, an effective voltage at the two ends of the thermal resistor being changedby changing a duty ratio of the PWM signals. The power consumption of different devices in the electronic system can be effectively simulated, so that the temperature field change in the electronic system is accurately expressed, the thermal design efficiency of the complex electronic system is improved, and the temperature field in the actual electronic system is prevented from exceeding the working temperature range of normal devices.

Description

technical field [0001] The invention relates to the technical field of simulation, in particular to a thermal simulation device and method. Background technique [0002] As the number and integration of electronic systems become higher and higher, electronic systems become more and more complex, and the heating of equipment in complex electronic systems has become a key point that cannot be ignored. For example, high temperature will not only lead to unstable operation of the electronic system, shorten the service life, and may even burn some components. The heat that causes high temperature does not come from outside the electronic system, but from inside the electronic system, or inside the integrated circuit. Therefore, before designing the electronic system, the thermal simulation of the electronic system has guiding significance for the designer to consider whether it is necessary to install a cooling device when designing the electronic system. [0003] Generally, th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00
CPCG01R31/00
Inventor 刘鹏超李雄峰李金钊赵伟刘雷陈海峰
Owner BEIJING RES INST OF MECHANICAL & ELECTRICAL TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products