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Positioning device, positioning method thereof and substrate processing equipment

A technology for positioning devices and substrates, applied to measuring devices, optical devices, instruments, etc., can solve problems such as inability to complete positioning, material scratches, and bending

Active Publication Date: 2020-10-30
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem mainly solved by the present invention is to provide a positioning device, substrate processing equipment and positioning method, which can solve the problem that the existing technology can not complete the positioning for some materials without substrates, and the materials on the substrates are positioned by mechanical contact. It is easy to cause the problem of scratching and bending of the material

Method used

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  • Positioning device, positioning method thereof and substrate processing equipment
  • Positioning device, positioning method thereof and substrate processing equipment
  • Positioning device, positioning method thereof and substrate processing equipment

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Embodiment Construction

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. The terms "first", "second" and the like in the claims, description and drawings of th...

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PUM

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Abstract

The invention relates to a positioning device. The positioning device comprises a tray which is used for bearing a to-be-positioned part provided with a positioning mark, a material taking assembly which is used for taking out the to-be-positioned part from the tray, a first image sensing assembly which is used for acquiring the current position information of the positioning mark, and a driving assembly which is connected with the material taking assembly so as to drive the material taking assembly to move according to the difference between the current position information and the standard position information, so that the to-be-positioned part is in a standard posture corresponding to the standard position information; and the device further comprises a second image sensing assembly which is used for acquiring the position information of the positioning mark when the to-be-positioned part is in the standard posture. The positioning device provided by the embodiment of the inventioncan provide positioning for a substrate-free material, does not cause scratching and bending of the material, reduces the downtime rate, and improves the production efficiency.

Description

technical field [0001] The technical solution of the present invention relates to the field of material processing, in particular to a positioning device and its positioning method, and substrate processing equipment. Background technique [0002] During the processing of some materials, it is necessary to obtain the marking information of the material and locate it. In the prior art, mechanical contact pre-positioning is used on the substrate first, and then the next step of positioning is performed. However, for some materials without a substrate, the positioning cannot be completed, and the mechanical contact positioning of the material on the substrate is likely to cause scratches and bending of the material. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a positioning device, substrate processing equipment and positioning method, which can solve the problem that the existing technology can not complete th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/00
CPCG01B11/00
Inventor 阳凯迟彦龙唐国平王祥何云尹建刚高云峰
Owner HANS LASER TECH IND GRP CO LTD