A mode converter for silicon photonics chip

A technology of mode spot converter and silicon photonic chip, which is applied in the direction of optical waveguide and light guide, can solve the problems of reducing waveguide-to-waveguide coupling efficiency, low coupling efficiency of mode spot converter, low direct coupling efficiency, etc., and achieves applicability and flexibility Strong, simple structure, small size effect

Active Publication Date: 2021-01-08
SUZHOU CREALIGHTS TECH
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Problems solved by technology

The direct coupling efficiency between the two is extremely low, which is not only due to the difference in refractive index between the two, but more importantly, the mismatch of the mold spot caused by the difference in the size of the mold spot
Due to the limitation of the size of the spot converter in the vertical direction, the propagation mode is a flat Gaussian mode, which greatly reduces the coupling efficiency from waveguide to waveguide, resulting in low coupling efficiency of the spot converter.

Method used

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  • A mode converter for silicon photonics chip
  • A mode converter for silicon photonics chip
  • A mode converter for silicon photonics chip

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] Such as figure 1 and figure 2 As shown, the present application is a mode speckle converter for a silicon optical chip, including a lower cladding layer 1, an upper cladding layer 4, and a waveguide layer 2, the waveguide layer 2 is located between the lower cladding layer 1 and the upper cladding layer 4, and the waveguide Layer 2 includes a waveguide matrix 20 and a waveguide 30. The waveguide matrix 20 is disposed on the lower cladding layer 1. The...

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Abstract

The invention discloses a mode speckle converter for a silicon optical chip, which comprises a lower cladding layer and an upper cladding layer, a waveguide layer is provided between the lower cladding layer and the upper cladding layer, and the waveguide layer includes a waveguide base body and is arranged on the waveguide layer One end of the waveguide is connected to the input optical waveguide, and the other end is connected to the output optical waveguide. Butting one end to a section with a linearly reduced size between the waveguide and the optical waveguide makes the mode spot sizes of the two optical waveguides gradually match, thereby realizing efficient coupling between the two mode spots. The waveguide used in the mode-spot converter of the silicon photonics chip has a three-dimensional tapered structure, and its size is linearly reduced in the vertical and horizontal directions, so as to realize gradual matching with the size and shape of the input optical waveguide, and can improve the distance between the two modes. coupling efficiency.

Description

technical field [0001] The invention relates to the technical field related to silicon photonic chips, and more precisely relates to a mode converter for silicon photonic chips. Background technique [0002] Photonic integration, that is, photonic integrated circuit, is an optical waveguide integrated circuit that integrates optical devices with a dielectric waveguide as the center. Light path for certain functions. In the future high-speed, large-capacity information network system, photon integration technology will become the main technology. Since silicon materials have high bandwidth, low insertion loss, and are easy to realize optical components such as splitters, modulators, and detectors required for optical interconnection, silicon photonic chips are currently the main means of photonic integration, and this patent is also mainly Developed for silicon photonics chips. A key technology in optical integration is to achieve effective coupling between optical wavegui...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): G02B6/14
CPCG02B6/14
Inventor汪军平金梦溪陈操卢德海胡朝阳
OwnerSUZHOU CREALIGHTS TECH