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Printed wiring board and method for producing printed wiring board

一种印刷配线板、厚度方向的技术，应用在印刷电路制造、印刷电路、印刷电路等方向，能够解决形成空隙不便等问题

Pending Publication Date: 2020-12-15
SUMITOMO ELECTRIC IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the diameter of the via hole is reduced, the opening of the via hole is closed by the metal plating before the metal sufficiently fills the inside of the via hole, and there is an inconvenience of forming a void (space not filled with metal) in the inside of the via hole.

Method used

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  • Printed wiring board and method for producing printed wiring board
  • Printed wiring board and method for producing printed wiring board

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Experimental program
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Embodiment Construction

[0013] [Issues to be solved by this disclosure]

[0014] When considering the concentration of plating current formed at the edge portion between the inner peripheral surface of the through hole and the upper and lower surfaces of the insulator, the taper angle of the through hole needs to be increased to a certain extent. Therefore, in the case of applying the structure described in the above publication to a flexible printed wiring board, when bending stress is applied to the flexible printed wiring board, at the center portion of the insulator in its thickness direction, the stress easily concentrated at the edge formed on the inner peripheral surface of the through hole, so that cracks are easily generated around the edge. As a result, the durability and conductivity of the printed wiring board may become insufficient.

[0015] The present disclosure was conceived in view of the above circumstances, and an object is to provide a printed wiring board and a method for manuf...

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Abstract

A printed wiring board according to one embodiment of the present disclosure is provided with: an insulating material which has a first surface, a second surface that is on the reverse side of the first surface, and a through hole that penetrates therethrough from the first surface to the second surface; and a metal plating layer which is formed on the first surface and the second surface of the insulating material and the inner circumferential surface of the through hole. The inner diameter of the through hole gradually decreases from the first surface toward the second surface of the insulating material; the average diameter of the through hole in the first surface of the insulating material is from 20 [mu]m to 35 [mu]m (inclusive); the average diameter of the through hole in the secondsurface of the insulating material is from 3 [mu]m to 15 [mu]m (inclusive); and the average thickness of the metal plating layer formed on the first surface and the second surface of the insulating material is from 8 [mu]m to 12 [mu]m (inclusive).

Description

technical field [0001] The present disclosure relates to a printed wiring board and a method for manufacturing the printed wiring board. [0002] This application is based on and claims priority from Japanese Patent Application No. 2018-89178 filed on May 7, 2018, the entire contents of which are incorporated herein by reference. Background technique [0003] In recent years, wiring of printed wiring boards has been refined, and there is a need to reduce the thickness of the printed wiring board and to reduce the size of through holes provided in the printed wiring board. [0004] In general, through-holes are formed by performing electroless plating on the inner peripheral surface of the through-hole formed in a base insulator, and performing electroplating on an adherend electroless plating layer formed by electroless plating. In electroplating, plating current tends to concentrate at the edge portion formed between the inner peripheral surface of the through hole and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
CPCH05K1/115H05K1/118H05K2201/0154H05K2201/0141H05K2201/0145H05K2201/09545H05K2201/09827H05K2201/09563H05K2201/09745H05K3/426H05K3/424H05K2203/072H05K2203/0723H05K3/0047H05K2203/107H05K3/42
Inventor 高桥贤治今崎瑛子新田耕司酒井将一郎三浦宏介松本雅弘齐藤裕久
Owner SUMITOMO ELECTRIC IND LTD