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Method and equipment for detecting hole site information of printed circuit board

A technology for printed circuit boards and testing equipment, which is applied in the direction of measuring devices, instruments, and optical devices, and can solve problems such as time-consuming testing procedures, slow inspection speed, and unfavorable product mass production efficiency.

Active Publication Date: 2021-02-02
UTECHZONE CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, such a detection procedure is time-consuming and the inspection speed is very slow, which is not conducive to the mass production efficiency of products

Method used

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  • Method and equipment for detecting hole site information of printed circuit board
  • Method and equipment for detecting hole site information of printed circuit board
  • Method and equipment for detecting hole site information of printed circuit board

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Embodiment Construction

[0037] Figure 1A It is a schematic diagram of a detection device for hole position information of a printed circuit board according to the present invention. Please refer to Figure 1A The detection device 100 for hole position information of a printed circuit board (hereinafter referred to as the detection device 100 for short) of this embodiment includes a stage 110 , an image acquisition device 120 and an image processing device 130 . The printed circuit board 200 to be tested is suitable to be placed on the stage 110 to take an image of at least the through hole H of the printed circuit board 200 . The image processing device 130 is electrically connected to the image acquisition device 120 for processing and analyzing the image of the through hole H of the printed circuit board 200 captured by the image acquisition device 120 .

[0038] The image acquisition device 120 can be disposed above or below the stage 110 . In other words, including but not limited to, the image...

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Abstract

The invention provides a method and equipment for detecting hole site information of a printed circuit board. The detection method of the hole site information of the printed circuit board at least comprises the following steps that an image acquisition device is provided to acquire an image of through holes in the printed circuit board, and the through holes comprise a first hole and a second hole; analyzing a first arc-shaped image on the image of the through hole by the image, and obtaining first circle center position information according to the first arc-shaped image; analyzing whether asecond arc-shaped image still appears in the first arc-shaped image by the image, and obtaining second circle center position information according to the second arc-shaped image; and judging the alignment between the first hole and the second hole according to the first circle center position information and the second circle center position information.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a method and equipment for detecting hole position information of a printed circuit board. Background technique [0002] Printed circuit boards are one of the indispensable components of products such as electronics, computers and communications. In order to meet the demand for light, thin, short, small, high-density and high-reliability products in the market, printed circuit boards have gradually developed to have through holes, blind holes (blind holes or vias) and buried holes (buried holes) at the same time. ). Blind vias and buried vias are used to connect the internal wiring boards with the surface wiring, without penetrating the entire board and wasting the layout space of other wiring boards, so the overall volume of the printed circuit board can be reduced. [0003] Even with the setting of blind vias and buried vias, the formation of through holes is still an indispensable ...

Claims

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Application Information

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IPC IPC(8): G01B11/00
CPCG01B11/00
Inventor 邹嘉骏
Owner UTECHZONE CO LTD
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