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Double-sided automatic welding equipment for glass packaged temperature sensor

By designing double-sided automatic welding equipment for glass-encapsulated temperature sensors, we have solved the accuracy and quality problems in the straightening, cutting, silvering and welding processes of Dume wire during the production process, achieving an efficient and reliable welding process to ensure that the product can be used at high temperatures. Reliability and performance in the environment.

Active Publication Date: 2021-02-12
XINGQIN YICHANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] During the bonding process, it is necessary to weld the front and back sides of the chip with a length and width of several millimeters with Dumet wire, and the existing equipment does not provide a foundation
[0006] In addition, how to perfectly fuse the cylindrical glass shell with the internal chip and Dumet wire after inserting the glass shell and ensure that the cylindrical glass shell is elliptical, the existing equipment cannot do this
[0007] From the systematic molding process of straightening, cutting, dipping silver, soldering chips, baking silver, inserting glass tubes and high-temperature molding, the existing technology has not given a good solution for reference

Method used

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Examples

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Effect test

Embodiment Construction

[0070] Such as Figure 1-2 As shown, a double-sided automatic welding equipment for glass-encapsulated temperature sensors includes a conveying platform 1, on which, from left to rear, there are successively a transfer fixture lowering mechanism 2, a straightening and shearing mechanism 3, and a silver dipping mechanism 4 , Chip welding mechanism 5. The above mechanisms respectively complete the process of Dumet silk thread straightening --> straightening --> clamping wire --> cutting --> jig transfer --> cutting --> silver dipping --> sticking film.

[0071] The straightening and shearing mechanism 3, the silver dipping mechanism 4, and the chip welding mechanism 5 are intersected with a first transfer jig conveying mechanism 9, and the first transfer jig conveying mechanism 9 is used to equidistantly transfer the transfer jigs 13 Convey at intervals, and the first transfer jig conveying mechanism 9 in different sections adopts different intervals for conveying.

[0072] Su...

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PUM

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Abstract

The invention discloses double-sided automatic welding equipment for a glass packaged temperature sensor. The equipment comprises a conveying platform; a transferring jig lowering mechanism, a straightening and shearing mechanism, a silver staining mechanism and a chip welding mechanism are sequentially arranged on the conveying platform from left to back; and first transfer jig conveying mechanisms are arranged among the straightening and shearing mechanism, the silver staining mechanism and the chip welding mechanism in a crossed manner. According to the double-sided automatic welding equipment for the glass packaged temperature sensor, automatic machining of the glass packaged temperature sensor can be achieved.

Description

technical field [0001] The invention relates to the production field of glass-encapsulated temperature sensors, in particular to double-sided automatic welding equipment for glass-encapsulated temperature sensors. Background technique [0002] In the production process of NTC thermistor, the following process needs to go through: Dumet wire straightening --> straightening --> clamping wire --> cutting --> jig transfer --> cutting --> dipping silver -- ->Adhesive film-->Preheating-->Baking silver-->Insert glass tube-->Preheating-->High temperature forming-->Flip-->Preheating-->High temperature forming-->Receiving . [0003] The wire pins used by NTC thermistors are Dumet wires, and the diameter of Dumet wires is less than 0.3m / m. The Dumet wires are nickel-iron alloys with copper plating and are generally used in the diode or light bulb (tube) industry. Because the Dumet wire is nickel-iron alloy, the wire diameter is small an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K1/14
CPCG01K1/14Y02P40/57
Owner XINGQIN YICHANG ELECTRONICS