Automatic welding packaging equipment of glass package temperature sensor

Abstract

The invention discloses automatic welding packaging equipment of a glass package temperature sensor. The equipment includes a conveying platform. A load transfer jig lowering mechanism, a straightening shearing mechanism, a silver dipping mechanism, chip welding mechanisms, a silver baking mechanism, a glass shell insertion mechanism and a glass sealing forming mechanism are arranged in turn froma left to a back on the conveying platform. First load transfer jig conveying mechanisms are arranged in an intersected manner among the straightening shearing mechanism, the silver dipping mechanism,the chip welding mechanisms and the glass shell insertion mechanism. Second load transfer jig conveying mechanisms are arranged at the silver baking mechanism and the glass sealing forming mechanism.The automatic welding packaging equipment of the glass package temperature sensor provided by the invention can realize automatic machining of the glass package temperature sensor.

Description

technical field [0001] The invention relates to the production field of glass-encapsulated temperature sensors, in particular to automatic welding and packaging equipment for glass-encapsulated temperature sensors. Background technique [0002] In the production process of NTC thermistor, it needs to go through the following process: Dumet wire straightening --> straightening --> clamping wire --> cutting --> jig transfer --> cutting --> dipping silver -- ->Adhesive film-->Preheating-->Baking silver-->Insert glass tube-->Preheating-->High temperature forming-->Flip-->Preheating-->High temperature forming-->Receiving . [0003] The wire pins used by NTC thermistors are Dumet wires, and the diameter of Dumet wires is less than 0.3m / m. The Dumet wires are nickel-iron alloys with copper plating and are generally used in the diode or light bulb (tube) industry. Because the Dumet wire is a nickel-iron alloy, the wire diameter is sm...

AI Technical Summary

Problems solved by technology

[0005] During the bonding process, it is necessary to weld the front and back sides of the chip with a length and width of several millimeters with Dumet wire, and the existing equipment does not provide a foundation

[0006] In addition, how to perfectly fuse the cylindrical glass shell with the internal chip and Dumet wire after inserting the glass shell and ensure that the cylindrical glass shell is elliptical, the existing equipment cannot do this

[0007] From the systematic molding process of straightening, cutting, dipping silver, soldering chips, baking silver, inserting glass tubes and high-temperature molding, the existing technology has not given a good solution for reference

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