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Foam buffer adhesive tape for electronic products and preparation method thereof

A technology of electronic products and foams, applied in adhesives, film/sheet-like adhesives, pressure-sensitive films/sheets, etc., can solve problems such as difficult to achieve interlayer damage, difficult to control cells, poor reworkability, etc., and achieve considerable Effects of anti-drop damage, good sealing protection, and good reworkability

Pending Publication Date: 2020-11-24
HUBEI XIANGYUAN NEW MATERIAL TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, it is far from enough to meet the needs of users. After the mobile terminal using foam material is damaged or malfunctions, it is difficult to repair it.
When manufacturers or repairers clean up waste foam tapes, they usually encounter foam tapes that are difficult to remove at one time, easily broken into multiple knots, or difficult to achieve interlayer damage, which also leads to poor reworkability in the repair process.
The patent with the notification number CN202671481U proposes an adhesive tape, which improves the overall strength of the foam tape, but also brings about the problem of insufficient foam softness due to excessive foam strength, which reduces the mobile terminal. Resistance to drop damage
[0005] There are also other design schemes in the prior art that use multi-layer co-extrusion to directly extrude multi-layer foams to design different cohesive energy between layers, but this method also has certain disadvantages. Extrusion foaming, It is difficult to control the cells in the non-crosslinked state of the matrix material, and it is impossible to obtain a smooth foam surface, which affects the gap filling ability of the foam tape, resulting in poor sealing performance
In the prior art, different interlayer cohesive foams are bonded together by thermal compounding or adhesive layers are used to bond different foams into the above structure, but the same also exists Other problems, such as cell deformation or breakage caused by heat during the heating and compounding process of thermally compounded foam, and the bonding of glue still exist under certain conditions. Damage to the surface of the foam substrate affects the sealing performance and cushioning performance

Method used

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  • Foam buffer adhesive tape for electronic products and preparation method thereof
  • Foam buffer adhesive tape for electronic products and preparation method thereof
  • Foam buffer adhesive tape for electronic products and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] The structure of the foam buffer tape of this embodiment is composed of a foam center main body layer, an adhesive layer, and a release film, wherein the adhesive layer is distributed on both sides of the foam center main body layer, and the release film is distributed on the adhesive layer On both sides, the release film is silicone oil-coated release paper, the adhesive layer is pressure-sensitive acrylic adhesive, and the bonding strength between the adhesive layer and the central main body layer is 8N / 25cm.

[0056] In this embodiment, the foam central body layer is composed of three layers, including the foam layer as the middle layer and the foam layer S1 and foam layer S2 located on both sides of the middle layer. The cohesive energy strength of the foam layer S1 and the foam layer S2 is 12N / 25cm, and the cohesive energy strength of the foam layer W is 4N / 25cm.

[0057] Wherein the foam layer W consists of the following formula:

[0058] 8 parts of resin A, 80 p...

Embodiment 2

[0063] The structure of the foam buffer tape of this embodiment is composed of a foam center main body layer, an adhesive layer, and a release film, wherein the adhesive layer is distributed on both sides of the foam center main body layer, and the release film is distributed on the adhesive layer On both sides, the release film is silicone oil-coated release paper, the adhesive layer is pressure-sensitive acrylic adhesive, and the bonding strength between the adhesive layer and the central main body layer is 8N / 25cm.

[0064] The main body layer of the foam center is composed of a three-layer structure, including the foam layer W in the middle layer, the foam layer S1 and the foam layer S2 on the upper and lower sides. The cohesive energy of the foam layer S1 is 25N / 25cm, the cohesive energy strength of the foam layer S2 is 12N / 25cm, and the cohesive energy strength of the foam layer W is 5N / 25cm.

[0065] Wherein the foam layer W consists of the following formula: 8 parts of...

Embodiment 3

[0074] The structure of the foam buffer tape of this embodiment is composed of a foam center main body layer, an adhesive layer, and a release film, wherein the adhesive layer is distributed on both sides of the foam center main body layer, and the release film is distributed on the adhesive layer On both sides, the release film is silicone oil-coated release paper, and the adhesive layer is pressure-sensitive acrylic resin. The bonding strength of the adhesive layer and the central body layer is 8N / 25cm.

[0075] The main body layer of the foam center consists of a 4-layer structure, including the foam layer W in the middle layer, the foam layer S1 and the foam layer S2 on the upper and lower sides, and the foam distributed between the foam layer W and the foam layer S1 Layer O. The cohesive energy strength of the foam layers S1 and S2 is 12N / 25cm, the cohesive energy strength of the foam layer W is 5N / 25cm, and the cohesive energy of the foam layer O is 25N / 25cm.

[0076] ...

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Abstract

The invention discloses a foam buffer adhesive tape for electronic products. The foam buffer adhesive tape at least comprises three layers, namely a central main body layer, an adhesive layer A and arelease film B from inside to outside; the adhesive layer A is distributed on one side or two sides of the central main body layer, and the release film B is distributed on the adhesive layer A; the central main body layer at least comprises three foam layers, namely a foam layer W, and a foam layer S1 and a foam layer S2 which are distributed on the two sides of the foam layer W respectively; andthe central main body layer further comprises foam layers O, and the number of the foam layers O is n which is larger than or equal to 0. The invention further discloses a preparation method of the foam buffer adhesive tape for the electronic products. Controllable cohesive energy exists among all the foam layers, when foam is subjected to destructive impact, interlayer directional damage occursin the foam, considerable falling damage resistance is provided for the electronic products, and meanwhile the products can be easily repaired.

Description

technical field [0001] The invention belongs to the technical field of foam tapes, and more specifically relates to a foam buffer tape for electronic products and a preparation method thereof. Background technique [0002] With the continuous development of mobile terminals (mobile phones, tablet computers, notebook computers, etc.), in order to meet people's higher sense of experience, mobile phone manufacturers have gradually abandoned the use of traditional metal materials, and used ceramic glass to achieve higher aesthetics and comfort. Sensitive material as the shell material of the mobile phone. This ceramic or glass design can no longer use traditional screws between the parts of the mobile terminal, so the connection or filling material represented by foam tape plays a key role. The sensory enjoyment and more humanized design brought by electronic products for user experience provide services for mobile terminals in terms of safety, comfort, convenience and humanize...

Claims

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Application Information

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IPC IPC(8): C09J7/29C09J7/26C09J7/38
CPCC09J2203/326C09J2400/243C09J2423/046C09J2433/00C09J7/29C09J7/385
Inventor 柳景亚魏琼
Owner HUBEI XIANGYUAN NEW MATERIAL TECH INC
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