Method for manufacturing tantalum core of high-capacity tantalum capacitor

Abstract

The invention provides a method for manufacturing a tantalum core of a high-capacity tantalum capacitor, and the method comprises the following steps: providing a tantalum block forming die which is provided with a cavity, putting a proper amount of tantalum powder into the cavity, manufacturing the tantalum core in a regular quadrangular shape by a compression molding process, and arranging a pressure relief structure on the tantalum core, and then sequentially carrying out oxidation treatment and heat treatment on the tantalum core to finish the manufacturing process. By the adoption of thetechnical scheme, the tantalum core is provided with the pressure relief structure, the tantalum core can be prevented from loosening in the tantalum capacitor shell, the potential difference betweentantalum powder particles in the process of forming a dielectric oxide film is reduced, the infiltration capacity of the tantalum core in a forming solution is enhanced, the purpose of reducing the difficulty of forming the dielectric oxide film, the crystallization point of the oxide film is reduced, the electrical property of the tantalum capacitor is guaranteed, and the service life of the tantalum capacitor is prolonged. According to the tantalum capacitor, the crystallization point of the oxide film is reduced, the electrical property of the tantalum capacitor is guaranteed, the service life of the tantalum capacitor is prolonged, and the service life of the tantalum capacitor is further prolonged by performing oxidation treatment on the tantalum core and performing heat treatment under the inert gas atmosphere condition.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a method for manufacturing a tantalum core of a large-capacity tantalum capacitor. Background technique [0002] At present, high-voltage, large-capacity capacitors are indispensable in energy storage circuits and filter circuits of various electronic equipment. Considering factors such as reliability and energy storage filtering effect, a high-performance all-tantalum capacitor is an ideal choice. In the prior art, the high-performance all-tantalum capacitor is generally in the shape of a cylinder. Since more than 90% of the high-performance all-tantalum capacitor is tantalum metal, the relative molecular weight of the tantalum metal is relatively large, and the mass is also large, so that the tantalum capacitor is easy to store when placed flat. Rolling, when the tantalum capacitor rolls, the internal tantalum core also rolls, it is not easy to fix, and when the ...

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Problems solved by technology

In the prior art, the high-performance all-tantalum capacitor is generally in the shape of a cylinder. Since more than 90% of the high-performance all-tantalum capacitor is tantalum metal, the relative molecular weight of the tantalum metal is relatively large, and the mass is also large, so that the tantalum capacitor is easy to store when placed flat. Rolling, when the tantalum capacitor rolls, the internal tantalum core also rolls, it is not easy to fix, and when the gap between the tantalum core and the tantalum capacitor shell is large, the tantalum core is prone to loosening, which affects the electrical performance of the tantalum capacitor, and sometimes even Make the tantalum capacitor fail and cause a burst accident. In addition, since the anode lead and the cathode lead of the tantalum capacitor are respectively arranged at the upper and lower ends of the cylindrical capacitor, it is not easy to be installed on various existing large-scale integrated circuit PCB boards. The technology generally fixes the tantalum capacitor on the PCB board by welding the anode lead or the cathode lead, using a special mounting bracket, using a binding wire for binding, or using silica gel or epoxy resin for bonding. These methods require the use of additional It is very inconvenient to load and unload components or materials, and under the same capacity conditions, cylindrical tantalum capacitors take up more space than cuboid tantalum capacitors, which affects the fixing of other electronic components on the PCB board and affects the final PCB board. Integration, and the heat dissipation effect is not good

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