Fan-out packaging structure of filter and packaging method thereof
A packaging structure and filter technology, applied in the fields of electrical solid device, semiconductor device, semiconductor/solid state device manufacturing, etc., can solve the inconsistency of device performance in installation accuracy, strict flatness requirements of substrate and sealing cover, and unsatisfactory radio frequency. Module requirements and other issues to achieve the effect of improving process yield, thin packaging structure and low cost
Pending Publication Date: 2021-02-12
XIAMEN SKY SEMICON TECH CO LTD
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- Application Information
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Problems solved by technology
[0004] 1. The cost of the surface sealing cover is relatively high;
[0005] 2. The reliability of the product has strict requirements on the flatness of the substrate and the sealing cover, which is easy to cause failure
Method used
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Embodiment Construction
[0040] The present invention will be further described below through specific embodiments.
[0041] see figure 1 , a filter fan-out packaging structure, including a chip 10, the chip 10 is provided with a first surface, a second surface, the first surface has a pad 11 and a functional area 12, and also includes an encapsulation material 20, a wall 30. The cover plate 40 and the connection port 50; the area other than the first surface of the chip 10 is plastic-encapsulated by the encapsulation material 20; the first surface of the chip 10 is provided with a wiring layer 13, and the wiring layer 13 is electrically connected to the pad 11 and extends To the first surface of the encapsulation material 20; the wall 30 is arranged on the exposed part of the first surface of the chip 10, the surface of the wiring layer 13 and the exposed part of the first surface of the encapsulation material 20, and in the external connection area of the wiring layer 13, the chip 10 The function...
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The invention discloses a fan-out packaging structure of a filter and a packaging method thereof. The fan-out packaging structure comprises a chip, the chip is provided with a first surface and a second surface, the first surface is provided with a bonding pad and a functional area, and the area, except the first surface, of the chip is plastically packaged through a packaging material; the firstsurface of the chip is provided with a wiring layer, and the wiring layer is electrically connected with the bonding pad and extends to the first surface of the packaging material; a wall body is arranged at the exposed part of the first surface of the chip, the surface of the wiring layer and the exposed part of the first surface of the packaging material, and openings are arranged in the external connection area of the wiring layer and the functional area of the chip; a cover plate covers an opening of the functional area on the surface of the wall body to form a cavity; the opening of the external connection area is provided with a connection port, and the connection port is electrically connected with the wiring layer to realize fan-out. The method is simple in process, low in cost andsmall in size, and the packaging reliability is improved.
Description
technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a fan-out packaging structure of a filter and a packaging method thereof. Background technique [0002] Some semiconductor devices, functional components require a cavity as a working environment, such as surface acoustic filter equipment, which is widely used in radio frequency RF and intermediate frequency IF technology, and its applications include portable phones, wireless phones and various radio settings. Through the use of surface acoustic filtering, these electronic devices are processed by filtering and delaying electrical signals. Due to the performance and design function requirements of surface acoustic filter products, it is necessary to ensure that the functional area of the filter chip cannot touch any substance, that is, the functional area of the chip needs to provide a working environment with a cavity. [0003] However, the current main packaging tec...
Claims
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IPC IPC(8): H01L23/31H01L21/50H01L21/56H03H3/08
CPCH01L23/3107H01L21/50H01L21/561H01L21/568H03H3/08H01L2224/18
Inventor于大全姜峰张晓东
OwnerXIAMEN SKY SEMICON TECH CO LTD