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Equipment and method for improving adsorption stability of Taiko sheet

A technology of stability and equipment, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of small contact area, unstable adsorption, debris, etc., to achieve the effect of improving product yield, avoiding stability, and reducing equipment warnings

Inactive Publication Date: 2021-02-26
HUA HONG SEMICON WUXI LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above-mentioned shortcoming of the prior art, the object of the present invention is to provide a kind of equipment and the method for improving the adsorption stability of Taiko sheet, be used to solve in the prior art because the contact area of ​​Taiko sheet outer ring and vacuum adsorption equipment is little, causes The adsorption is unstable, resulting in the problem of falling pieces and fragments

Method used

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  • Equipment and method for improving adsorption stability of Taiko sheet
  • Equipment and method for improving adsorption stability of Taiko sheet

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Embodiment Construction

[0021] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0022] see Figure 1 to Figure 2 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arb...

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Abstract

The invention provides equipment and a method for improving adsorption stability of a Taiko sheet. The equipment provided with a vacuum ring is provided; the Taiko sheet with a pattern on the front surface is provided, and a layer of protective film is adhered to the front surface of the Taiko sheet; the Taiko sheet is placed on the protrusion of the vacuum ring with the front face facing upwardsso that the outer ring on the back surface of the Taiko sheet is adsorbed through the groove of the protrusion; the back surface of the Taiko sheet is thinned; and a protective film on the front surface of the Taiko sheet is torn off. By improving the width of the groove of the vacuum ring, the contact area of the outer ring of the Taiko sheet and the groove is increased so that the adsorption stability of the Taiko sheet is avoided, the product yield is improved, and equipment early warning is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a device and a method for improving the adsorption stability of Taiko sheets. Background technique [0002] In the backside process of BGBM, before the back grinding (Back grinding) of the wafer, the front side of the taiko chip needs a film layer to protect the front pattern of the wafer, and the protective film layer on the front side of the wafer is torn off after grinding . [0003] In the process of tearing off the film layer of the film tearing equipment, the outer ring of the Taiko sheet will be adsorbed on the vacuum ring of the equipment; due to the small contact area between the outer ring of the Taiko sheet and the vacuum ring, it will be affected by the pulling force when the film is torn off. When the adsorption is unstable , It is easy to cause the risk of wafers being pulled off and fragmented. [0004] Due to the small contact area between the vacuum ring...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6838H01L21/6836H01L2221/68313
Inventor 裴少帅苏亚青吕剑王浩旭
Owner HUA HONG SEMICON WUXI LTD
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