Unlock instant, AI-driven research and patent intelligence for your innovation.

Thin film circuit structure

A circuit structure and film technology, applied in printed circuits, printed circuits, printed circuit parts, etc., can solve the problems of difficult control of batch printing quality, increased product defect rate, and increased production costs, so as to achieve easy quality control and reduce The effect of production cost and quality stability

Active Publication Date: 2021-03-05
PRIMAX ELECTRONICS LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the printing materials of silver paste and carbon ink are printed in batches, there will be a problem of mutual adhesion between each other. In the case of mutual adhesion of silver paste and carbon ink, the impedance value will rise sharply instantaneously, making batch printing The quality is not easy to control, in addition to increasing the defect rate of products, it also directly leads to the increase of production costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin film circuit structure
  • Thin film circuit structure
  • Thin film circuit structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] see figure 1 , which is a schematic cross-sectional view of a thin film circuit structure according to an embodiment of the present invention. Such as figure 1 As shown, the thin film circuit structure 1 of this embodiment includes a first film substrate 11 , a second film substrate 12 , an insulating and isolating substrate 13 , a first circuit layer 14 and a second circuit layer 15 . The first film substrate 12 and the second film substrate 12 are disposed opposite to each other. The insulating isolation substrate 13 is disposed between the first film substrate 11 and the second film substrate 12 . The first circuit layer 14 is disposed on the first film substrate 11 and located between the first film substrate 11 and the second circuit layer 15 . The second circuit layer 15 is disposed on the second film substrate 12 and located between the second film substrate 12 and the first circuit layer 14 . The first circuit layer 14 and the second circuit layer 15 respect...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a thin film circuit structure. The thin film circuit structure comprises a first thin film substrate and a first circuit layer. The first circuit layer is disposed on the firstthin film substrate. The first circuit layer comprises first conductive silver paste and second conductive silver paste. The first conductive silver paste has a first impedance value. The second conductive silver paste has a second impedance value, and the first impedance value is 10-15 times of the second impedance value.

Description

technical field [0001] The invention relates to the field of input devices, in particular to a thin-film circuit structure for a keyboard device. Background technique [0002] With the rapid development of science and technology, the vigorous development of electronic equipment has brought a lot of convenience to human life, so how to make the operation of electronic equipment more humanized is an important issue. Common input devices of electronic equipment include a mouse device, a keyboard device, and a trackball device, among which the keyboard device can be used for users to directly input characters and symbols into the computer, so it is highly valued. [0003] Most of the known keyboard devices include a bottom plate, a thin film circuit board, a scissor connection element, a keycap and an elastic element, and the scissor connection element is connected between the bottom plate and the keycap. For thin film circuit boards, it is usually made of three films, which ar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/16H05K1/09
CPCH05K1/167H05K1/09H05K2201/0317
Inventor 陈柏安潘锦松
Owner PRIMAX ELECTRONICS LTD