Unlock instant, AI-driven research and patent intelligence for your innovation.

Optical sensor package

A package and component technology, applied in semiconductor devices, instruments, measuring devices, etc., can solve problems such as failure, package failure, and interface cracking

Pending Publication Date: 2021-03-12
STMICROELECTRONICS SRL
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Over time, the forces acting on the cap and substrate interface can lead to cracking at the interface or even separation of the cap from the substrate, either of which can lead to package failure or incapacitation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Optical sensor package
  • Optical sensor package
  • Optical sensor package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015]Figure 1 to 5 Various views of one or more embodiments of the package 100 are illustrated, and the package 100 can be an optical sensor package. referenceFigure 1 to 5 The package 100 includes a first surface 102 (which can be referred to herein as the upper surface or top surface) and a second surface 104 opposed to the first surface 102 (which can be referred to herein as the lower surface or bottom surface). The package 100 also includes a first component 106 and a second component 108. As described herein, the first component 106 is coupled to the second assembly 108 by a sealing material (which may be a resin material, and can be referred to herein as the resin 110), and the package material is coated on the assembly 106, 108 to at least Part of the sealing assemblies 106, 108, and forming a package 100. Components 106, 108 may also be referred to herein as package, sub-package, subassembly, system, subsystem, semiconductor device, semiconductor package, or other similar ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
sizeaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The present disclosure is directed to an optical sensor package with a first assembly and a second assembly with an encapsulant extending between and coupling the first assembly and the second assembly. The first assembly includes a first substrate, a first die on the first substrate, a transparent material on the first die, and an infrared filter on the transparent material. The second assembly includes a second substrate, a second die on the second substrate, a transparent material on the second die, and an infrared filter on the transparent material. Apertures are formed through the encapsulant aligned with the first die and the second die. The first die is configured to transmit light through one aperture, wherein the light reflects off an object to be detected and is received at the second die through another one of the apertures.

Description

Technical field[0001]The present disclosure relates to an optical sensor package, and more particularly to an optical sensor package having a resin surrounding the package.Background technique[0002]A optical sensor package is known to convert light into an electronic signal. Typically, the optical sensor package is a cavity package having a cap (CAP) coupled to the substrate and a cavity or space between the cap and the semiconductor device on the substrate. The cap includes an opening such that the light emitting die on the substrate transmits the light by an opening in the cap, and the light passes through another opening in the cap, and is received by the receiving tube core on the substrate. In operation, the object from the optical sensor is interrupted or reflected from the light line of the light-emitting die, which results in the amount or strength of the light received at the light pipe core compared to the operating conditions when there is no object for detecting. differe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/167H01L31/0203H01L31/18
CPCH01L31/167H01L31/0203H01L31/18G01S7/4813G01S17/04G01S17/08H01L31/02005
Inventor 栾竟恩
Owner STMICROELECTRONICS SRL