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Circuit board and semiconductor apparatus

A circuit board and semiconductor technology, applied in the direction of semiconductor devices, circuits, printed circuits, etc., can solve problems such as cost

Pending Publication Date: 2021-03-12
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, whenever the mounting substrate on which the semiconductor device is to be mounted is changed, it is necessary to modify the ground wiring inside the semiconductor device, and therefore, there is a problem that costs are incurred when modifying the wiring of the wiring substrate of the semiconductor device.

Method used

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  • Circuit board and semiconductor apparatus
  • Circuit board and semiconductor apparatus
  • Circuit board and semiconductor apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] [Structure of Semiconductor Device]

[0021] figure 1 is a perspective view showing an example of the structure of the semiconductor device 1 of Embodiment 1. Such as figure 1 As shown in , in a semiconductor device 1 , a semiconductor chip 2 constituted by a plurality of circuit blocks (not shown) is mounted on a wiring substrate 4 , and the semiconductor chip 2 and the wiring substrate 4 are connected by conductive bonding wiring 6 . Note that the wiring substrate 4 is also called "circuit board" or "printed circuit board". In the semiconductor device 1, such as figure 1 As shown in , the semiconductor chip 2 and the plurality of bonding wirings 6 are covered and sealed with a sealing member 7 (indicated by a chain line in the figure) formed of a sealing resin. in addition, figure 1 The semiconductor device 1 shown in is a BGA (Ball Grid Array) type semiconductor package in which ball electrodes 9 serving as external terminals are arranged in an array on the side...

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PUM

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Abstract

Disclosed are a circuit board and a semiconductor apparatus. The circuit board includes a plurality of bonding pads having a first bonding pad and a second bonding pad configured to supply a ground potential; a first ground wiring connected to the first bonding pad; a second ground wiring connected to the second bonding pad; and a first extension pad connected to the first ground wiring and a second extension pad connected to the second ground wiring, the first extension pad and the and second extension pad being provided in a different area from an area in which the plurality of bonding padsis provided, the first extension pad and the and second extension pad being connectable through a wire.

Description

technical field [0001] The present invention relates to a circuit board on which a circuit is mounted and a semiconductor device on which the circuit board is mounted. Background technique [0002] A semiconductor device is a semiconductor chip in which a plurality of circuit blocks such as an analog circuit or a digital circuit is mounted on a wiring substrate (also called a "circuit board" or "printed circuit board") and integrated into a single package s installation. In order to reduce electromagnetic interference (EMI) emitted from semiconductor devices, various countermeasures such as those described below are being studied with respect to semiconductor devices. For example, countermeasures for suppressing EMI noise by inserting a capacitor between a power supply wiring that supplies a power supply voltage and a ground wiring that supplies a ground potential inside a package of a semiconductor device are being studied. In addition, countermeasures are being studied w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/184H05K1/025H01L23/64H01L24/48H01L2224/48227H01L23/49838H01L23/50H01L2924/15311H01L2224/49173H01L2224/04042H01L2224/06153H01L2224/06155H01L2224/49052H01L2224/48091H01L24/49H01L24/02H01L23/49811
Inventor 盐道宽贵秋山哲森厚伸
Owner CANON KK