A barrel plating device for matching hardware and its working method

Abstract

The invention discloses a barrel plating device for matching hardware, which includes an electroplating tank, a roller located in the electroplating tank, a power supply for electrifying the electroplating solution in the electroplating tank, and a driving part for driving the roller; There is an insulating second drum inside, the axis of the drum is parallel to the second drum, the main part of the second drum is a grid hollow structure; the second drum is fixed on the lower half of the drum through the boom assembly, and the second The second electroplating part in the drum communicates with the first electroplating part in the drum through electric wires; the second drum is provided with an end cover that can be opened on at least one side, and the material of the boom assembly is insulating material. A barrel plating device for matching hardware disclosed by the invention sets an internal roller and a self-driven second roller, so that independent rollers are required according to the tumbling efficiency of parts to be plated in different sizes, so that each size All parts have good internal and external rolling efficiency under the same electroplating environment.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a barrel plating device used for supporting hardware and a working method thereof. Background technique [0002] The supporting hardware includes small-sized hardware such as buttons, zippers, trouser hooks, and belt buckles. The electroplating is often achieved by barrel plating. The existing barrel plating includes horizontal barrel plating, inclined barrel plating and vibrating barrel plating. plating. [0003] like figure 1 As shown, the horizontal barrel plating equipment includes a cylinder 1 arranged in an electroplating tank, and a cathode conductor 111 is arranged in the cylinder 1. The cathode conductor is often a copper wire coated with an insulating layer, and one end has a conductive terminal and is connected to the The electroplating parts are in contact, and the cylinder 1 is provided with a diversion hole for convection of the electroplating solution. The anode 112...

AI Technical Summary

Problems solved by technology

[0004] At present, the electroplating of matching hardware often adopts horizontal barrel plating, because the matching hardware often has different sizes and quantities, for example, the matching zipper includes zipper puller and zipper element, and the size of the chain element is larger than that of the zipper puller. The size is small, but the number of chain teeth is more than that of the zipper puller. If they are mixed and placed in the drum, the number of plating is different due to the different sizes. On the one hand, the stacking density of the hardware to be plated in the drum is different, such as figure 2 As shown, the volume of the zipper pullers 12 in the drum 1 is large but the number is small, and the volume of the fastener elements 13 is small but the number is large, so that the zipper pullers with a small number but a large volume tend to be trapped for a long time during electroplating and tumbling. The inside of the chain elements 13 with a large number of small volumes is electrostatically shielded, and the zipper puller 12 cannot obtain better rolling efficiency, so that the electroplating effect of the zipper puller 12 is poor

That is, the difference in current density flowing through the surface of each electroplating part will lead to the difference in plating thickness and electroplating effect. On the other hand, when the hardware parts to be electroplated with different sizes are tumbling with the drum synchronously, the hardware parts to be electroplated with different sizes cannot be alternated inside and outside synchronously. Tumbling, resulting in a large difference in plating effect

Moreover, it is also time-consuming and labor-intensive to separate the hardware after mixing and placing and electroplating

In addition, separate electroplating of hardware parts of different sizes through two processes will lead to differences in the electroplating environment such as the concentration of the electroplating solution, resulting in differences in the electroplating of the supporting hardware parts, and at the same time reducing the electroplating efficiency

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