Thermal repair method and device

A technology of hot repair and waiting to be repaired, which is applied in the direction of program control device, program code conversion, code compilation, etc. It can solve problems such as hot repair failure and hot repair patch conflict, and achieve the effect of avoiding conflicts

Active Publication Date: 2021-04-16
BEIJING BYTEDANCE NETWORK TECH CO LTD
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  • Abstract
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Problems solved by technology

The SDK hot repair solution in the prior art is generally a hot repair solution for a single SDK. Since the APK can choose to access one or more of multiple SDKs, if the hot repair solution for a single SDK is reused one by one Hot fixes are performed for each SDK, and when multiple SDKs are connected to the same APK at the same time, it is very likely to cause conflicts between SDK hot fixes, resulting in failure of hot fixes

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  • Thermal repair method and device
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  • Thermal repair method and device

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Embodiment Construction

[0065] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the solutions of the present invention will be further described below. It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0066] In the following description, many specific details have been set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here; obviously, the embodiments in the description are only some embodiments of the present invention, and Not all examples.

[0067] In the embodiments of the present invention, words such as "exemplary" or "for example" are used as examples, illustrations or illustrations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present invention shall no...

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Abstract

The embodiment of the invention provides a hot repair method and device, and relates to the technical field of software maintenance. The method comprises the steps of compiling each SDK to obtain a compiled file of each SDK; wherein the to-be-repaired project comprises at least two SDKs with a dependency relationship, and the compiled file of each SDK comprises an instrumentation code of each to-be-repaired method; if the target to-be-repaired method exists in the plurality of SDKs, reserving the instrumentation code of the target to-be-repaired method in one of the SDKs, and deleting other instrumentation codes of the target to-be-repaired method; generating a thermal repair patch, wherein the thermal repair patch comprises a patch corresponding to the instrumentation code of each to-be-repaired method; and when the access end accesses the compiled file of the at least one SDK of the to-be-repaired project, sending the hot repair patch to the access end. The method of the invention is used for avoiding conflicts among the hot repair patches of the SDKs when the plurality of SDKs which can be selectively accessed and have the dependency relationship are subjected to hot repair.

Description

technical field [0001] The invention relates to the technical field of software maintenance, in particular to a hot repair method and device. Background technique [0002] The hotfix technology, also known as the patch technology, is a technical means that can repair abnormalities in the software product line quickly and at low cost. [0003] In some application scenarios, a software product needs to provide multiple optional components externally, and the multiple optional components have dependencies with each other, and the software development kit (SDK) corresponding to these optional components Software Development Kit, SDK) may be integrated into the same Android application installation package (AndroidApplication package, APK). In such application scenarios, each SDK cannot be regarded as a completely independent SDK during hot repair, and hot repair needs to be performed on all these SDKs. The SDK hot repair solution in the prior art is generally a hot repair solu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/36G06F8/41G06F9/445
CPCG06F11/36G06F8/41G06F8/658
Inventor 魏君成
Owner BEIJING BYTEDANCE NETWORK TECH CO LTD
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