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Preparation method of array substrate, array substrate and liquid crystal display panel

A technology of array substrates and substrate substrates, which is applied in semiconductor/solid-state device manufacturing, instruments, semiconductor devices, etc., can solve problems that do not have practical applications, and achieve the effect of realizing manufacturing costs

Active Publication Date: 2022-02-08
HKC CORP LTD +1
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  • Application Information

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Problems solved by technology

[0005] However, the 3-pass photolithography technology in the prior art does not have the possibility of practical application, thus, there is an urgent need for a preparation method of an array substrate that can reduce the cost compared with the 4-pass photolithography technology

Method used

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  • Preparation method of array substrate, array substrate and liquid crystal display panel
  • Preparation method of array substrate, array substrate and liquid crystal display panel
  • Preparation method of array substrate, array substrate and liquid crystal display panel

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Embodiment Construction

[0038] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

[0039]Unless otherwise defined, technical terms or scientific terms used in this application shall have the usual meanings understood by those skilled in the art. The terms "first", "second", "third", "fourth" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Thus, a feature defined as "first", "second", "third" and "fourth" may expressly or implicitly include one or more of these features. In the description of the embodiments of the present application...

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Abstract

The present application provides a preparation method of an array substrate, an array substrate and a liquid crystal display panel, which relate to the field of display technology. The preparation method of the array substrate includes: sequentially depositing a first metal layer and a multi-film layer on a base substrate, and performing The first photolithography process, forming the first metal pattern layer and the multi-thin film pattern layer on the first metal pattern layer; sequentially depositing the first insulating layer and the photoresist layer, from the side of the substrate away from the first metal pattern layer , using the first metal pattern layer as a first mask, performing a second photolithography process to form a photoresist pattern layer; removing the first insulating layer not in contact with the base substrate, and peeling off the photoresist pattern layer. In this preparation method, the first metal pattern layer etched out after the first photolithography process is used as the mask plate of the second photolithography process, thereby saving a mask plate and reducing the manufacturing cost of the array substrate the goal of.

Description

technical field [0001] The present application belongs to the field of display technology, and particularly relates to a preparation method of an array substrate, an array substrate and a liquid crystal display panel. Background technique [0002] Liquid crystal display panels (LCDs) have the advantages of low radiation, small size and low power consumption, and are widely used in various electronic devices such as notebook computers and televisions. [0003] A liquid crystal display panel generally includes an array substrate (thin film transistor, TFT), a color filter substrate (color filter, CF), a liquid crystal (liquid crystal, LC) sandwiched between the array substrate and the color filter substrate, a sealant frame, and the like. [0004] In the prior art, the manufacturing technology of the array substrate has experienced from 7 times of lithography (7mask) to 5 times of lithography (5mask), then to 4 times of lithography (4mask) and 3 times of lithography (3mask) I...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/77H01L27/12G02F1/1362
CPCH01L27/1259H01L27/1288H01L27/1214H01L27/124G02F1/13625G02F1/136231
Inventor 刘凯军周佑联刘振许哲豪郑浩旋
Owner HKC CORP LTD
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