Check patentability & draft patents in minutes with Patsnap Eureka AI!

Vibration assembly of electronic equipment and electronic equipment

A technology for vibration components and electronic equipment, which is applied in electrical components, branch equipment, piezoelectric/electrostrictive transducers, etc., and can solve problems such as inability to hear clearly, blocking of earphone sound holes, and unfavorable user privacy.

Pending Publication Date: 2021-09-10
HUAWEI TECH CO LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the sound leakage through the sound hole of the earpiece is serious, which is not conducive to protecting the privacy of users
At the same time, the sound received by the user from the sound outlet of the earpiece is not loud enough to hear clearly
In addition, dirt is easy to enter the sound hole of the earpiece, causing the sound hole of the earpiece to be blocked and causing noise

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vibration assembly of electronic equipment and electronic equipment
  • Vibration assembly of electronic equipment and electronic equipment
  • Vibration assembly of electronic equipment and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] In order to better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0038] It should be clear that the described embodiments are only a part of the embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the protection scope of the present application.

[0039] In a specific embodiment, the present application will be further described in detail below through a specific embodiment and in conjunction with the accompanying drawings.

[0040] Electronic equipment has gradually canceled the original earpiece sound hole, that is, the electronic device no longer uses the earpiece sound hole to produce sound, but uses the screen to produce sound. Screen sound is usually achieved by pasting a vibra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention provides a vibration assembly of electronic equipment and the electronic equipment, and the vibration assembly comprises a vibration sheet which is used for being connected with a screen of the electronic equipment; and a vibrator which is connected with the vibration piece and can vibrate, wherein the vibrating reed is provided with a protruding part, and the protruding part protrudes out of the vibrating reed in the thickness direction of the electronic equipment. According to the electronic device, the overall thickness of the vibrating reed does not need to be increased, the rigidity of the vibrating reed is increased by arranging the protruding part on the vibrating reed, so that the vibration strength of the vibrating reed is improved, and the protruding part can be arranged at a position which does not interfere with other components of the electronic device. Therefore, when the vibrating reed provided with the protruding part is installed on the electronic equipment, the risk of interference with other parts can be reduced, so that space arrangement of all the parts is facilitated, the thickness of the electronic equipment cannot be obviously increased, and the electronic equipment can be light and thin.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a vibration component of an electronic equipment and the electronic equipment. Background technique [0002] In the existing electronic equipment, a vibration module is arranged inside the housing, and the housing is provided with an earpiece sound outlet. The vibration module vibrates and emits sound, which is transmitted to the outside through the earpiece sound outlet. , the sound can pass into the user's ear. However, the sound leakage through the sound hole of the earpiece is serious, which is not conducive to protecting the privacy of the user. At the same time, the sound received by the user from the sound outlet of the earpiece is not loud enough to hear clearly. In addition, dirt can easily enter the sound outlet of the earpiece, causing the sound outlet of the earpiece to be blocked and causing noise. Contents of the invention [0003] The pr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02H04M1/03
CPCH04M1/026H04M1/0266H04M1/035H04M1/03H04M1/02H04R17/00
Inventor 王继伟杨枭叶千峰陆文佳周威存
Owner HUAWEI TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com