Chip-detecting method, chip-detecting structure and chip-carrying structure
A technology for chip detection and carrying structure, which is applied in semiconductor/solid-state device testing/measurement, electrical measurement, measuring devices, etc., can solve the problems of reducing the detection efficiency of light-emitting diode chips and the difficulty of optical detection of light-emitting diode chips, etc.
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no. 1 example
[0025] refer to Figure 1 to Figure 11 As shown, the first embodiment of the present invention provides a chip detection method, which at least includes the following steps: first, coordinate Figure 1 to Figure 3 As shown, a chip detection structure 1, a chip carrying structure 2 and a plurality of welding material groups 3 are provided, the chip detection structure 1 includes a plurality of micro heater groups 11, the chip carrying structure 2 is used to carry a plurality of chips C, and a plurality of The welding material group 3 is arranged between the chip carrying structure 2 and the chip detection structure 1 (step S100); then, cooperate Figure 1 to Figure 4 As shown, the chip carrying structure 2 and the chip testing structure 1 are brought close to each other, so that each welding material group 3 contacts the chip carrying structure 2 and the chip testing structure 1 at the same time, and each welding material group 3 includes a low temperature welding material grou...
no. 2 example
[0036] refer to figure 1 , Figure 11 and Figure 12 As shown, the second embodiment of the present invention provides a chip detection method. Depend on Figure 12 and Figure 10 It can be seen from the comparison that the biggest difference between the second embodiment and the first embodiment is: after the step S108 of separating a plurality of good chips (C-GO) and the chip detection structure 1, the chip detection method of the second embodiment further includes : First, match figure 1 and Figure 12 As shown, a plurality of good chips (C-GO) are transferred to a circuit substrate P sequentially or simultaneously (step S110 (B)); then, coordinate figure 1 , Figure 11 and Figure 12As shown, through a material removal module R (for example, the photoresist stripping liquid provided by the photoresist stripping liquid supply equipment, which can be an organic solvent or an inorganic solvent), to remove a chip carrying substrate 20 of the chip carrying structure 2 ...
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