Moisture-proof packaging body of electronic component

Abstract

The invention discloses a moisture-proof packaging body of an electronic component, and belongs to the field of electronic component packaging, the moisture-proof performance is effectively improved by adding a moisture-proof ring at the joint of two packaging shells, the moisture-proof ring and a waterproof groove are bent and inserted to block direct penetration of moisture, and the moisture is absorbed through a water absorption pad on the moisture-proof ring, and transmits to a water absorption ball through a soft water strip so that the water absorption ball is expanded, waterproof glue and deionized water in the upper side and the lower side of the moisture-proof ring move outwards under the expansion and extrusion action of the water absorption ball, an elastic sealing film is punctured by a puncture rod under the extrusion action to release the waterproof glue, the connection strength of the two packaging shells is improved, and water penetration is effectively blocked; and meanwhile, the deionized water pushes the position indicating piece outwards, so that a signal can be transmitted to the outside, and external personnel can find the crack timely and accurately and repair the crack conveniently.

Description

technical field [0001] The invention relates to the field of packaging of electronic components, in particular to a moisture-proof packaging body for electronic components. Background technique [0002] Electronic components are basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions, such as amplifiers, radio receivers, oscillators, etc. One of the common ways to connect electronic components is to solder them to a printed circuit board. Electronic components may be individual packages (resistors, capacitors, inductors, transistors, diodes, etc.), or groups of varying complexity, such as integrated circuits (op amps, resistors, logic gates, etc.). [0003] Electronic components are relatively delicate, so they need to be packaged in a high-strength moisture-proof casing. The electronic component package is ...

AI Technical Summary

Problems solved by technology

[0004]At present, the strength of the package body of electronic components is relatively high, but it is slightly insufficient in moisture resistance. Cracks are prone to appear at the joints of the package shell, and moisture from the outside is easy to penetrate into the inside , which will cause a short circuit of the electronic components, and the gaps that appear are extremely small, which is not easy for personnel to check and repair

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