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Method for manufacturing resonator element, resonator element, and resonator device

A vibration element and manufacturing method technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, electrical components, piezoelectric devices/electrostrictive devices, etc., can solve unintended processing, frequency accuracy of vibration elements, Deterioration of reliability, possible exposure to unintended parts, etc.

Pending Publication Date: 2021-12-31
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the vibrating element described in Patent Document 1, when laser light is irradiated to the weighted film on the inclined surface, the laser light is reflected obliquely depending on the inclination angle of the inclined surface, and the reflected laser light may be irradiated to an unintentional object. part, performing unintended processing on the irradiated part
For example, if the reflected laser beam is irradiated to the weight film and wiring on the adjacent vibrating arm to process this part, there is a problem that the frequency accuracy and reliability of the vibrating element will deteriorate.

Method used

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  • Method for manufacturing resonator element, resonator element, and resonator device
  • Method for manufacturing resonator element, resonator element, and resonator device
  • Method for manufacturing resonator element, resonator element, and resonator device

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no. 1 approach ＞

[0024] figure 1 It is a sectional view showing the resonator device according to the first embodiment of the present invention. figure 2 yes means figure 1 A top view of the vibrating element of the vibrating device. image 3 yes figure 2 The A-A line sectional view in. Figure 4 yes figure 2 B-B line sectional view in. Figure 5 is a schematic diagram showing the driving vibration mode of the vibrating element. Figure 6 is a schematic diagram showing the detection vibration mode of the vibration element. Figure 7 It is a cross-sectional view showing a weight portion included in the drive arm. Figure 8 and Figure 9 Respectively means Figure 7 A cross-sectional view of a modified example of the weight portion shown. Figure 10 It is a figure which shows the manufacturing process of a vibration device. Figure 11 It is a plan view showing a vibrating element formed on a quartz wafer.

[0025] It should be noted that, for the sake of illustration, in addition ...

no. 2 approach ＞

[0100] Figure 12 It is a cross-sectional view showing a vibrating element according to a second embodiment of the present invention.

[0101] The resonator device 100 of the present embodiment is the same as the resonator device 100 of the first embodiment described above except that the structures of the weight parts 262 , 272 , 282 , and 292 included in the resonator element 1 are different. Therefore, in the following description, regarding the resonator device 100 of the second embodiment, differences from the above-mentioned first embodiment will be mainly described, and descriptions of the same matters will be omitted. In addition, in Figure 12 In , the same reference numerals are assigned to the same configurations as those in the above-mentioned embodiment. In addition, since the weight parts 262 , 272 , 282 , and 292 have the same structure, the weight part 262 will be representatively described below for the convenience of description, and the description of the ...

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Abstract

Provided are a method for manufacturing a resonator element, a resonator element, and a resonator device capable of suppressing a reduction in driving characteristics and reliability. The method of manufacturing a resonator element includes: a preparation step of preparing a resonator element having a base portion, a resonator arm, and a weight applying film; the resonator arm is provided with an arm portion extending from the base portion and a weight applying portion positioned on the tail end side of the arm portion; the weight applying portion is provided with a first main surface and a second main surface which are in positive and negative relation; the weight applying film is arranged on the first main surface of the weight applying portion; the first main surface is provided with a first plane, a second plane and an inclined surface; the second plane is closer to the second main surface side than the first plane and is parallel to the first plane; the inclined surface connects the first plane and the second plane, and an angle formed between the inclined surface and the first plane is 100 degrees or less. And the method also includes a removal step in which the weight applying film is irradiated with energy rays from the normal direction of the first plane to remove a part of the weight applying film.

Description

technical field [0001] The invention relates to a manufacturing method of a vibrating element, a vibrating element and a vibrating device. Background technique [0002] Patent Document 1 discloses a vibrating element including: a base; a vibrating arm extending from the base and having an arm and a weight; and a weight film formed on the weight. In addition, the upper surface of the weight part has a convex shape, and has a first flat surface, a second flat surface located on both sides of the first flat surface and a lower surface side of the first flat surface, and a second flat surface connecting the first flat surface and the second flat surface. The inclined surface of two flat surfaces. And a weight film is formed over these 1st flat surface, 2nd flat surface, and an inclined surface. In such a vibrating element, the frequency of the vibrating element can be adjusted by irradiating the weighted film with laser light to remove part of the weighted film. [0003] Pate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H03H3/04H03H9/05H03H9/21G01C19/5628G01C19/5663
CPCH03H3/04H03H9/21H03H9/0595H03H3/02G01C19/5663G01C19/5628H03H9/215H03H9/0547H03H9/1014H03H2003/0442H10N30/2042H10N30/01H10N30/20H10N30/87
Inventor 小仓诚一郎
Owner SEIKO EPSON CORP