Curing composition and application thereof, cured polymer material and preparation method and application thereof
A composition and selected technology, applied in the field of curing materials, can solve the problems of volume shrinkage, easy volatilization, slow curing rate, etc., and achieve the effects of small volume shrinkage, non-volatile, and simple composition
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specific Embodiment approach 1
[0040] The curing composition contains component A and component B; the content molar ratio of the component A and the component B is 1:1; the component B is 5-hexenoic acid-3-butene Esters; the component A is bis(mercaptoacetic acid)-1,4-butylene diester.
specific Embodiment approach 2
[0041] The curing composition contains component A and component B; the content molar ratio of the component A and the component B is 1:1; and the component B is 5-hexenoic acid-3-butyl Enyl ester, the component A is bis(3-mercaptopropionic acid)ethylene glycol.
specific Embodiment approach 3
[0042] The curing composition contains component A and component B; the content molar ratio of the component A and the component B is 1:1; and the component B is 5-hexenoic acid-5-hexyl enyl ester; the component A is two (thioglycolic acid) ethylene glycol esters.
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