Preparation method of flexible light-emitting device, flexible light-emitting device and light-emitting device
A light-emitting device, flexible technology, applied in the manufacture of semiconductor/solid-state devices, identification devices, electric solid-state devices, etc., can solve the problems of not being well suited for flexible carriers and limiting the application of micro-LEDs
Active Publication Date: 2022-01-28
SHENZHEN SITAN TECH CO LTD
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Problems solved by technology
However, the application of micro-LEDs is mainly based on rigid carriers, which are not well suited for flexible carriers, which greatly limits the application of micro-LEDs
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[0032] The present disclosure provides a method for preparing a flexible light-emitting device. refer to figure 1 , figure 1 is a flow chart illustrating a method of fabricating a flexible light emitting device according to an embodiment of the present disclosure. Such as figure 1 As shown, the preparation method of the flexible light-emitting device includes the following steps S101-S106.
[0033] Step S101: providing a micro-LED array prepared on a first substrate and providing a TFT array prepared on a heat-resistant glue disposed on a second substrate.
[0034] Step S102: Transfer the micro-LED array from the first substrate to a third substrate by two transfers by means of adhesive glue, so that the electrodes of the micro-LED array are exposed.
[0035] Step S103: bonding the electrodes of the micro-LED array transferred onto the third substrate to the electrodes of the TFT array.
[0036] Step S104: removing the second substrate to expose the heat-resistant glue. ...
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Abstract
The invention provides a preparation method of a flexible light-emitting device, a flexible light-emitting device and a light-emitting device. The method comprises the following steps of: providing a micro LED array prepared on a first substrate, and providing a TFT array prepared on heat-resistant glue arranged on a second substrate; transferring the micro LED array from the first substrate to a third substrate by means of an adhesive and through twice transfer, so as to expose electrodes of the micro LED array; bonding the electrodes of the micro LED array transferred to the third substrate with the electrodes of the TFT array; removing the second substrate, and exposing the heat-resistant glue; fixing the micro LED array and the TFT array which are connected on a flexible substrate through heat-resistant glue; and removing the third substrate. According to the preparation method, the micro LED array can be connected with the TFT array after being transferred twice, and the whole micro LED array is reliably and efficiently fixed on various flexible substrates, so that different functions are realized.
Description
technical field [0001] The present disclosure relates to the technical field of semiconductor LEDs, in particular, to a method for preparing a flexible light emitting device, a flexible light emitting device and a light emitting device. Background technique [0002] Micro LED has the advantages of smaller size, higher resolution, higher brightness, higher luminous efficiency, lower power consumption and good controllability. With the development of micro LED, in addition to display screens, micro LED is used in A variety of different products. However, the application of micro-LEDs is mainly based on rigid carriers, which are not well suited for flexible carriers, which greatly limits the application of micro-LEDs. Contents of the invention [0003] In order to solve the technical problems mentioned in the background art, the solution of the present disclosure provides a method for preparing a flexible light emitting device, a flexible light emitting device and a light em...
Claims
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IPC IPC(8): H01L21/50H01L21/60H01L25/075H01L25/16H01L33/00G09F9/33
CPCH01L21/50H01L25/0753H01L25/167H01L33/0093G09F9/33
Inventor 刘召军张珂周玮
Owner SHENZHEN SITAN TECH CO LTD