Microstrip patch phased array antenna unit and microstrip phased array

A phased array antenna and microstrip patch technology, which is applied in directions such as antennas, resonant antennas, and antenna grounding devices, can solve the problems of narrow antenna operating bandwidth, high processing cost, and increased antenna volume and quality, and achieves improved performance. Production efficiency, material cost reduction, and the effect of widening the bandwidth

Pending Publication Date: 2022-03-18
吉利科技集团有限公司 +2
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the number of layers of the radiation sheet increases, the materials used for the radiation sheet and the base material increase, the processing cost be

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microstrip patch phased array antenna unit and microstrip phased array
  • Microstrip patch phased array antenna unit and microstrip phased array
  • Microstrip patch phased array antenna unit and microstrip phased array

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0040] Next, the technical solutions in the embodiments of the present invention will be described in connection with the drawings of the embodiments of the present invention, and it is understood that the described embodiments are merely the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained without making creative labor without making creative labor.

[0041] The "one embodiment" or "Embodiment" hereinafter referred to herein means a specific feature, structure, or characteristic that can be included in at least one implementation of the present application. In the description of the present application, it is to be understood that the orientation or positional relationship of the term "upper", "lower", "left", "right", "top", "bottom", etc. is based on the drawings. The orientation or positional relationship is intended to facilitate the description of the present application and si...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a microstrip patch phased array antenna unit and a microstrip phased array, the antenna unit comprises a grounding substrate and a layer of conductor patch, and the conductor patch is laid on the grounding substrate; steps are arranged on the opposite angles of the conductor patch, and the conductor patch forms a plurality of different resonance circuits through the steps. The antenna unit can be tuned in a plurality of different frequency bands respectively to form a plurality of different resonant circuits and has a plurality of different resonant frequencies, so that the frequency band width of the antenna is broadened, and the antenna unit can save the materials of patches and base materials and reduce the material cost.

Description

technical field [0001] The invention relates to the technical field of antennas, in particular to a microstrip patch phased array antenna unit. Background technique [0002] Microstrip patch phased array antenna can be divided into horizontally integrated tile structure and vertically integrated brick structure according to the integration method. Among them, the tile-type phased array antenna has the characteristics of low weight, small size, and easy integration with the platform. The tile structure uses a multi-layer architecture to integrate and connect the radio frequency, control signal and power supply through vertical interconnection technology. The tile structure has become the mainstream of today's phased array antenna development. [0003] The tile-type phased array antenna unit generally adopts a multi-layer radiation patch unit, and the base material is filled between each two layers of radiation pieces, and the multi-layer radiation piece can expand the workin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01Q13/08H01Q1/48H01Q1/36H01Q9/04
CPCH01Q13/08H01Q1/48H01Q1/36H01Q9/0407
Inventor 吴永青潘运滨孙国军刘元柱
Owner 吉利科技集团有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap